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This paper presents the study on the effect of low- stacked layer, chip pad design structures, and shift pad design of a large die size Cu/low- chip for improving assembly and reliability performance on organic buildup substrate flip chip ball grid array (FCBGA). Bump shear characterization has been performed on the integrity of different stacked layer and pad structure, supported by bump...
Assembly challenges for a high density, high performance integrated circuit package have been studied with respect to leadfree solder, fine pitch, large die on an organic substrate. The stresses induced by the large die size, higher reflow temperature due to lead-free solder and the low solder standoff due to fine-pitch configuration has shown to affect the quality of the assembly package. Solder...
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