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Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221?C and 217?C, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of eutectic Sn-Pb solder2...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
A comparison study between Sn3.5Ag solder ball and conventional Sn3.8AgO.7Cu (SAC387) solder ball was conducted on 33??33 FCPBGA with SOP pad finishing. After assembly, samples were subjected to laser scanning for slanted ball inspection. Visual inspection under low power scope was done to check for wrinkled balls. Cold ball pull (CBP) was used to evaluate the solder joint strength at 4 conditions,...
The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3 um, 4 um, 5 um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The...
As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb- free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabrication of substrates to support Pb-free Semiconductor BGA product packaging. However, the set back...
In this work, Sn3.5Ag solder alloy was being studied for the purpose of Pb-free solder joint reliability improvement over conventional Sn3.8AgO.7Cu solder balls on Ball Grid Array (BGA) packages with Ni/Au pad finishing. The study was carried out in different levels. At individual solder joint level, Sn3.5Ag showed no intermetallic brittle failure in cold ball pull test even up to 6times multiple...
In this paper, the failure mode and solder bump strength for low-k flip chip devices were determined using die pull technique. The results show there is no significant difference between low-k and non low-k devices in terms of bumps strength for the amount of taffy in this device. However, there is different in failure mode which shows an increasing in VRO and SRO failure mode. Die pull test within...
In this paper, the failure mode and solder bump strength for low-k flip chip devices were determined using die pull technique. The results show there is no significant difference between low-k and non low-k devices in terms of bumps strength for the amount of taffy in this device. However, there is different in failure mode which shows an increasing in VRO and SRO failure mode. Die pull test within...
Lead-free flux used in lead-free solder ball attachment process has been found to play a vital role in improving lead-free solder joint robustness & performance. In this study, two water soluble lead-free solder ball attach fluxes, flux A & flux B, each from different supplier, were compared in terms of the following characteristics: time variation of flux properties, flux stability vs. temperature...
A comparison study was done between cold ball pull (CBP) test vs. the conventional ball shear test to further understand the advantages & challenges of CBP test as a method to assess lead-free solder joint performance. From this study, CBP was found to be a better and preferred tool that is able to identify poor lead free solder joint and hence to differentiate the performance of lead free solder...
This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt%...
This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and differential scanning calorimetry (DSC) respectively. Overall results indicates that Sn3.8AgO.7Cu having the most favorable results with...
The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni 0.01Co (SANC), and Sn3.5Ag. Then the lead free solder joint material samples were subjected...
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