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Spring wheat (Triticum aestivum L. cv. Triso) was grown in a free-air carbon dioxide (CO 2 ) enrichment (FACE) system at Stuttgart–Hohenheim (Germany) in 2008 to examine effects on crop yield and grain quality. Elevated CO 2 had no significant impacts on aboveground biomass and grain yield components except for an increase in thousand grain weight by 5.4% with size distribution shifted...
Wafer Level Packaging (fan-in WLB, Wafer Level Ball Grid Array) is the upcoming future packaging technology with many advantages in comparison to standard Ball Grid Array Packages. Advantages are especially the small package dimensions, excellent electrical and thermal performance, highest package interconnect density and integration possibilities at lowest packaging cost. Today, standard (fan-in)...
The main challenges of today's device packaging are miniaturization, continuously increasing operating frequencies/high data rates, high number of I/Os, reliability, and thermal requirements. One of the major package trends driven by mobile-phone applications is the Wafer Level Ball Grid Array (WLB). Drivers for the implementation of WLB technology are cost reduction, smaller form factor and better...
We present a fully operational 77 GHz SiGe mixer assembled in a chip-scale embedded wafer level BGA (eWLB) package. This innovative package has a footprint with a standard pad pitch of 0.5 mm and a standard package height of 0.4 mm. The results demonstrate an excellent potential of the eWLB package concept for mm-wave applications. The measured gain of the packaged mixer is in best case only 1 dB...
We present high frequency characterization of thin-film redistribution layers for an embedded wafer level BGA package technology. This technology is based on a "molded reconfigured wafer" concept where the chip area is not the limitation for external contacts. The flexible thin-film redistribution layers in the fan-out area enable the realization of high-density, low-loss transmission lines...
Wafer level packaging is gaining tremendous interest throughout the semiconductor industry, due to advantages in cost and performance. We report an embedded device technology, which is based on a molded 200 mm reconfigured wafer. Our approach is a way around the restrictions of standard wafer level packages, like the number of I/Os possible at a given pitch. This allows us to establish a broad packaging...
We report an innovative embedded device wafer level packaging technology based on a "molded reconfigured 200 mm wafer". Silicon dice are tested, grinded, and diced. For the set-up of the "reconfigured wafer" these bare silicon dice are placed faces down onto a carrier system. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression...
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