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BaTi5O11 thin films with single-layer thicknesses about 400 nm were deposited on the Si substrates by sol-gel method. The influence of surface morphology, optical and dielectric properties was mainly investigated. The diffraction pattern showed that the annealed films exhibited a polycrystalline microstructure, and the increase in grain size of BaTi5O11 thin films occurred with an increase in annealing...
Analogous to optical interferometry, scientists have developed seismic interferometry(SI) method, and its application in the field data have promoted the understanding and study of seismic wave propagation. Seismic interferometry can be applied to both controlled-source data and passive data. Under specific circumstances, the useful subsurface information can be retrieved with passive source seismic...
For the first time, a CO2 far-infrared laser annealing (CO2-FIR-LA) technology was developed as the activation solution to enable highly heterogeneous integration without causing device degradation for TSV-free monolithic 3DIC. This process is capable to implement small-area-small-load vertical connectors, gate-first high-k/metal gate MOSFETs and non-Al metal inter-connects. Such a far-infrared laser...
On-chip cache is often shared between processes that run concurrently on different cores of the same processor. Resource contention of this type causes performance degradation to the co-running processes. Contention-aware co-scheduling refers to the class of scheduling techniques to reduce the performance degradation. Most existing contention-aware co-schedulers only consider serial jobs. However,...
A microridge-like structure was prepared on the surface of a c-Si substrate with Au hard-masks by reactive ion etching and their application to CIGS photovoltaic devices. Compared to the planar and microridge-like structures. It can be clearly seen that the CIGS films peeled off from the Mo/polishing planar Si substrates. Hence, the microridge-like Si substrate can enhance the adhesion between CIGS...
In this paper, a gold nano-dot (Au-ND) is successfully prepared on a silicon tip apex for scanning Kelvin probe microscopy (SKPM) applications. An extra facile localized fluoride assisted Galvanic replacement reaction (LFAGRR) is proposed to replace the silicon (Si) atoms at the tip apex with Au ones. We successfully fabricated Au-ND coated tip apex by tapping the Si tip apex against a thin layer...
An adequate sequential etching though dielectrics, silicon and permanent adhesive material was successfully developed for the damascene interconnects in the face-to-back bumpless TSV Wafer on Wafer (WOW) processes. The induced bowing taken place at the etching of permanent adhesive was optimized and no void Cu metallization was achieved. According to those TSV technology, the upper and lower stacked...
The on-chip Transient Voltage Suppressor (TVS) embedded in the silicon based transceiver IC has been proposed in this paper by using 0.8 μm Bipolar-CMOS-DMOS (BCD) process. The structure of the on-chip TVS is a high voltage Dual Silicon-Controlled-Rectifier (DSCR) with ±19V of high holding voltage (Vh) under the evaluation of 100 ns pulse width of the Transmission Line Pulsing (TLP) system. The holding...
High-density piezoelectric micromachined ultrasonic transducer (pMUT) arrays have been designed and fabricated using silicon based micromachined process. These devices are based on a novel structure called “reverse-bonding”. Experimental results show that they have excellent performance, suitable resonance frequency and high reliability. The fabricated pMUT arrays are very promising for 3-D medical...
Piezoelectric micromachined ultrasonic transducer (pMUT) is a new approach for the construction of 2-D arrays for real-time 3-D medical imaging. In this work, 6times6 pMUT arrays with element pitch down to 150 mum were successfully fabricated and characterized. The devices consist of 2 mum PZT film on a 3 mum Si/SiO2 supporting layer, and the multilayered membrane was released by a two-step process...
Micromachined technology has been widely used to reduce device size and improve performance. In this paper, our research activities on micromachined piezoelectric acoustic devices at wide frequency range, from audio microphones to ultrasonic transducers, are reviewed. These devices are based on ferroelectric thin films, and exceed the conventional acoustic devices in excellent performance, miniaturized...
In this paper, we demonstrate TaN/fluorinated HfO2 CMOS devices, focusing on symmetry and asymmetry fluorine incorporation at top or bottom HfO2 interfaces. 16% permittivity enhancement, 65% and 91% mobility increases for electron and hole, respectively, under high electric field was achieved. Reliability of n- and p-MOSFET was improved 3 orders and 8% for GIDL and hot carrier immunity, respectively...
A heterogeneous 3-D integration scheme of low cost Liquid Crystal Polymer (LCP) and silicon substrates with microfluidic channels and circulating water is demonstrated. Theoretical and experimental data show the applicability of this technique as a means to introduce effective active cooling in high-frequency electronics without adversely impacting their RF performance. An LCP coplanar waveguide fabricated...
We report the development of an implantable multifunctional (glucose and cholesterol) needle type biosensor with integrated RF wireless circuitry for continuous in vivo monitoring of metabolites during short term stays in emergency room or intensive care unit. Silicon-based MEMS technologies are used for the fabrication of micro needle sensors. The whole device is covered by a biocompatible Parylene...
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