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High reliability, high transmission speed and low power consumption laser diodes are required for optical interconnect. We have developed 1060 nm Vertical Cavity Surface Emitting Lasers (VCSELs) with InGaAs/GaAs strained quantum wells, oxide-confined and double intracavity structures for the requirement. In this paper, an extremely long term aging test close to the actual operating temperature was...
In the through silicon via (TSV) structure for 3-dimentional integration (3DI), large thermal-mechanical stress acts in the BEOL layer caused by the mismatch in thermal expansion coefficient (CTE) of the TSV materials. The resulting high-stress region is thought to be the critical point for the initiation of the cracking or the de-lamination that affects the mechanical reliability. In this study,...
As a practical curing technique of low-k material for 32-nm BEOL technology node, we demonstrated that electron beam (e-beam) irradiation was effective to improve film properties of nano-clustering silica (NCS). We confirmed that by using optimized e-beam cure condition, NCS was successfully hardened without degradation of dielectric constant and the Young's modulus increased by 1.7 times compared...
Stress induce voiding (SIV) inside and under vias in copper interconnects with ldquowingrdquo-pattern were investigated for 90 nm and 65 nm node processes. The difference of two voidings are the resistance change during acceleration test and the diffusion path. However, common features were found between both types of voiding; the interconnect fails fast as the ldquowingrdquo area grows. Both types...
We have developed a multilayer substrate that is formed from a high thermal conductive resin including ceramic fillers at high density in order to realize a module that is more miniaturized and has lower thermal resistance. First, we realized a resin with a very high filler filling rate of 75% by mixing two kinds of spherical fillers different in particle size. The thermal conductivity of the insulation...
This paper reports the development of a non-smell and highly moisture durable optical adhesive. And further, we report reliability test results for optical devices assembled with this adhesive
The impact of chip-package interaction (CPI) on the mechanical reliability of Cu low-k interconnects was investigated using a 3D multi-level sub-modeling method. The analysis was focused on the die attach process for Pb-free solder where a high thermal load will occur during solder reflow before underfilling to maximize the packaging effect. We compared first the CPI for a CVD-OSG (k=3.0) with MSQ...
Hole transport and trapping in N/sub 2/O-nitrided oxides have been studied. It is shown that N/sub 2/O-nitridation of oxides suppresses hole injection into the oxides. The suppression of hole injection is a mechanism leading to the enhancement of reliability of the nitrided oxides under channel hot-hole and F-N stresses.
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