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This paper presents a parallel stabilized mixed Galerkin method for three-dimensional steady-state Darcy flow using OpenMP for shared memory architecture. In finite element problems, the computational complexity increases with increasing number of elements needed for large and complex geometry. Shared memory architecture offers a platform for solving such large and complex problems for practical applications...
In this paper, a convergence of finite element model using different types and sizes of mesh modes has been conducted. A thin-walled conical tube was modeled using plane shell element in LS-DYNA software under dynamic axial impact. The energy absorption and peak load of thin-walled tube by using various converged mesh sizes and mesh modes were analyzed. The importance in conducting a mesh convergence...
The conversion to Pb-free solders has already been implemented in the consumer market. However, the transition to Pb-free solders in the high performance, mission critical networking/server industry has not yet been fully implemented. A significant factor in the slow transition to Pb-free solders is the absence of industry accepted Pb-free acceleration transforms that can translate lab test results...
A custom SRAM was developed for high performance and high reliability network switching applications using 90 nm low-k silicon technology. It is a 13.6 mm x 18.4 mm flip chip chip scale package (CSP) with a 11.12 mm x 16.36 mm die. The package has 838 BGA balls at 0.5 mm pitch. The 0.5 mm ball pitch CSP minimizes electrical package parasitics and enables higher data rate performance. However, the...
Mechanical integrity of interlayer and intralayer dielectric films and its impact on interconnect reliability has become more important as critical dimensions in ultralarge-scale integrated circuits are continuously reduced and Cu interconnect, low-k dielectrics (Cu/low-k) are widely adopted for the new technology nodes. Mechanical integrity of the dielectric films and reliability of interconnect...
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