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This paper details a finite element modelling approach of the press pack assembly process for a diode in a power electronic module. Molybdenum and aluminum graphite have been investigated as suitable materials for the contact pad. Contact analysis has been used to model the pressurized thermal interface in order to extract both the stress and temperature distribution in the diode. Average temperature...
Stress effects during metal migration and their numerical modeling methods are reviewed. A multi-physics simulation method is proposed and developed so that the electric current and stress can be solved simultaneously and the vacancy concentration predicted in a seamless framework. The stress generated by atomic movement and back stress effects [1] have been especially considered and modeled in this...
Failures caused by the electromigration (EM) are becoming a primary reliability concern of integrated circuits and electronics packaging designers and manufacturers. In the foreseeable future, the trend of greater scale integration and further miniaturization in the microelectronics industry is expected to continue and this will make the metallization in electronics devices more susceptible to EM...
The physical phenomenon electromigration (EM) and computer simulation methods of EM in microelectronics devices have been reviewed. A multi-physics EM simulation method which can be used to predict voids appearance in conductors has been described and its relevant challenges have been discussed. The optimizing methods for nano-packaging are discussed in this work and shunt structure for solder joint...
Heterogeneous electronics based systems are driven by an increasing demand for smaller form factor, faster and higher-density interconnection, and miniaturisation all at a cheaper cost. 3D packaging, using through-silicon-via technology, is positioned to satisfy these requirements and Carbon Nanotubes as an interconnection technology is gaining extensive interest in the community. This paper provides...
Ball Grid Arrays (BGAs) are one of the dominant technologies for high-end packaging solutions of electronic circuits, especially where a high interconnect density is required. This paper aims at studying the solder isothermal fatigue failure characteristics in test structures that resembles BGAs. Test structures comprising between 1 and 8 small solder joints have been made using 96.5Sn3.0Ag0.5Cu lead-free...
The paper describes experimental and finite element modelling (FEM) analyses on BGA assemblies under vibration tests. The purpose is to evaluate reinforcement methods of large BGA submitted to vibrations. Two techniques are used in this test: a cord of glue around the BGA (`peel off joint'), and gluing all the ball matrix of the second level of the BGA (Underfilling). Comparison between SnPb and SAC...
The reliability of Cu/low k interconnect structures using Cu pillar bumps was investigated in this paper. First the characteristics related to electromigration (EM) of Cu pillars with Sn-Ag tips were studied and compared with full Pb-free Sn-Ag solder bumps. The simulation results revealed a significant reduction in the current crowding when Sn-Ag C4 solder was replaced by Cu pillar structures. As...
In this paper we investigated the interfacial delamination of through silicon via (TSV) structures under thermal cycling or processing. First finite element analysis (FEA) was used to evaluate the thermal stresses and the driving force of TSV delamaination. Then, the modeling results were validated by analytical solutions of the crack driving force deduced for a long crack at the steady state. Both...
Microdrawing is an important process of fabricating the microparts, especially the metal microparts. Under the micro tension test, it was found that the stress-strain curve increased steeply in the elastic deformation stage but gradually in the plastic deformation stage, with the decrease of the grain size. According to the stress-strain curve, the material model was established. Then the influence...
Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a...
Future analysis tools that predict the behavior of electronic components, both during qualification testing and in-service lifetime assessment, will be very important in predicting product reliability and identifying when to undertake maintenance. This paper will discuss some of these techniques and illustrate these with examples. The paper will also discuss future challenges for these techniques.
Anisotropic conductive films (ACFs) are widely used in the electronic packaging industries because of their fine pitch potential and the assembly process is simpler compared to the soldering process. However, there are still unsolved issues in the volume productions using ACFs. The main reason is that the effects of many factors on the interconnects are not well understood. This work focuses on the...
In this paper, the performance of flexible substrates for lead-free applications was studied using finite element method (FEM). Firstly, the thermal induced stress in the flex substrate during the lead free solder reflow process was predicted. The shear stress at the interface between the copper track and flex was plotted. This shear stress increases with the thickness of the copper track. Secondly,...
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