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Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface...
Summary form only given. One important function of microsystem packaging is to remove the heat generated by the integrated circuits (ICs). The thermal management of microsystems has now become more crucial as the power density of ICs increases dramatically. To remove the big amount of heat is a big challenge for the packaging technology. An attractive solution is to utilize new developed nanotechnologies...
Today's technology is tuned towards faster, smaller and better efficiency. This trend has resulted in tremendous heat being generated in microelectronics components and if not properly managed, it can result in failure of microelectronics components. A critical issue is the removal of this heat generated. We report here a new type of nano thermal interface material (Nano-TIM) using the electrospinning...
The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and...
This paper reports the results of an investigation to create a thermal interface material (TIM) with adhesive functions. Previous tests with electro-spun nano fibrous polymer materials indicate high thermal conductivity of the films, and even higher thermal conductivity and lower resistivity had subsequently been obtained by adding thermally conductive nano particles. The thickness of the TIMs produced...
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