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The mechanism of wirebonding bondability for ultra thin Copper wire is described in this research. Two major analyses are conducted in the present paper. In the first, the characteristic of heat affected zone (HAZ) and free air ball (FAB) on thin Copper (Cu) wire have been carefully experimental measured. Thin film interfacial micro-tribology behavior between Cu FAB and Al pad is examined by Atomic...
The aim of present research is to investigate the characteristic of ultra thin copper wire and aluminum pad. In the first, the electric flame-off (EFO) characteristic of ultra thin copper wire has been carefully examined. Experimental results show thermal aging effect has significantly influence on the micro structure of free air ball (FAB). Optical microscopic (OM) examination for an as-drawn copper...
An electro-thermo coupling finite element model for lead free Sn4.0Ag0.5Cu (SAC405) solder ball is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging in the present paper. SAC405 alloy solder ball are commonly used on BGA package and POP package. In this research, a single solder ball (bump) used on flip chip package is established to evaluate...
A comprehensive integrated electro-thermo coupling model is developed to investigate the electro-thermo-mechanical effects and electromigration analysis on Package-on-Package (POP) in this paper. POP packaging involves in ultra thin gold wire (??=1mil) on wirebonding and Sn4.0Ag0.6Cu (SAC405) solder ball on package. The current density arising in the aluminum pad (wirebonding) and in the Copper trace...
This paper demonstrates two major works, experimentally determines the material properties and accurately predicts the dynamic response of stressed region on the bond pad and beneath the contact area. The characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer...
In the present paper, the characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer during wire bonding process has been predicted by using finite element method. Material property for Cu wire from mechanical tensile test has shown much more rigid than Au wire...
The objective of this paper is focused on the hygroscopic swelling effect on polymeric material used in electronic package and thermo-hygro-structure coupled design and reliability analysis for finger printer package. For moisture absorption/desorption analysis, the ambient environment for temperature and humidity are set to be 60degC60%RH, 85degC60%RH and 85degC85%RH, respectively. The transient...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off (EFO) process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also carefully investigated. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also studied. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical model based...
The objective of this research is to investigate the effects of board-level drop test based on the support excitation scheme incorporated with the submodel technique for stacked-die packages. Three lead-free materials, namely SAC405 (Sn4Ag0.5Cu), SAC387(Sn3.8Ag0.7Cu) and Sn3.5Ag were used to demonstrate the transient dynamic response for solder balls subject to JEDEC pulse-controlled board-level drop...
A novel submodel scheme based on St. Venant's principle has been developed to evaluate the reliability thermal cycle test (TCT) for CMOS image sensor (CIS). The region of interested in board level CIS package is lead-free paste, which is the peak stressed area to predict fatigue life. A solid finite element model of CIS using ANSYS codes is developed to predict the thermal strain distributions. The...
The purpose of this research is to study the parametric factors of wire bonding and optimal design rules for 4-layer mini stack-die package. This paper demonstrates the characteristic of low loop height, fine bond pad pitch and long overhead staggered chip in mini SD package. The loop height is limited to 3.5mil, the diameter of gold wire is 0.8 mil and the bond pad pitch is 45mum. The collaborated...
The characteristic of overall structure for CMOS image sensor has been studied in this paper. This paper demonstrates the thermal design for the material of compound, UV glue as well as glass. A three-dimensional solid model of CMOS image sensor based on finite element ANSYS software is developed to predict the thermal strain distributions. It is found that the peak stress in UV glue plays a significant...
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