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In this work the technique for improvement of thin metal films adhesion to dielectric substrates by means of electric field is considered. It is shown that that with temperature and voltage treatment the increase in adhesion of copper films can reach four times in comparison with initial sample. Similar results were observed for molybdenum films.
The design of a stable electret on the basis of SiO2 would allow to create miniature microphones and other sensors that are built directly into the chip and manufactured simultaneously with the chip in a single technological cycle. However, the task for today is not solved because of the low electret stability, due to its hydrophilicity. The experiments showed that the most promising in terms of stability...
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