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This paper reports a newly developed UV-curable and film-shaped insulating material for IoT devices that require stretchability. The material features large stretch ability, high transparency, low moisture permeability and good embedding property. An availability of the material for the stretchable devices was demonstrated through prototyping a test model and its evaluation. The good result of stretching...
In this paper, the authors focus on the evaluation of novel film type thermo-plastic adhesives in thin wafer handling technology for temporary bonding purposes. The main advantages of the film type adhesives over spin coat adhesives are better uniformity of film, TTV control and high thermal stability of the film. Film type-A material has been developed and evaluated for thermal slide-off thin wafer...
This paper describes newly-developed optical waveguide materials and their future applications in optoelectronic circuit boards. The materials achieved low optical loss and high thermal reliability, as well as good flexibility. We fabricated both flexible and rigid optoelectronic circuit board prototypes using these newly-developed materials, and successfully demonstrated light signal transmission...
We developed a high-speed (20 Gbps) and high-density (480 Gbps/cm2) optical printed circuit board with a new two-lens optical interface for optical interconnections, and successfully demonstrated a 20-Gbps operation in our optical interconnection.
Macroscopic and microscopic dissipative structural patterns are formed in the course of drying a suspension of Chinese black ink on a cover glass and in a dish. The time for the drying and the pattern area increased as the particle concentration increased. The broad ring patterns of the hills accumulated with the particles formed around the outside edges on a macroscopic scale. The height and the...
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