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Design of memory I/O channels or general purpose I/O (GPIO) has become very complicated as we aim for higher speeds, higher I/O count and cost-effective solutions. At these speeds, package and die discontinuities cause more deterministic jitter and noise due to inter-symbol interference (ISI) effects and crosstalk. Therefore, to improve timing margins, engineers have to carefully study impact of package...
As power consumption of modern SOC or FPGA devices continues to increase, meeting electro migration (EM) requirement becomes a significant challenge. The required number of I/O and power balls increases as the device performance and power increase. However, the available package balls are limited and the number of ground or power balls is often not increased compared to the device performance causing...
This paper presents a study on noise transfer from receiver to transmitter circuits of high-speed tranceivers through a commonly connected power delivery network (PDN) on package or printed circuit board (PCB). Receiver circuits like decision-feedback equalizer (DFE) are power hungry and can generate lot of current on the PDN. Jitter and noise measurements are performed to quantify the amount of noise...
As data rate increases, crosstalk becomes a significant source of high jitter. Although many techniques have been investigated to reduce crosstalk, it is not possible to fully eliminate coupling. In particular, near-end coupling between transmitter (TX) to receiver (RX) occurs at the interface of chip and PCB is one of the main sources of crosstalk. This TX to RX coupling is detrimental compared to...
For single-ended signaling DDR4 channels at 3200Mbps, signal and power integrity issues become increasingly challenging with much smaller voltage and timing windows to balance the budget. As systems increase data rate and IO count, supply noise does not scale accordingly. We present a system level signal and power co-simulation analysis to optimize system performance under stringent timing requirement...
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