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Ceria slurry used for polishing semiconductor wafers at the shallow trench isolation step has become very expensive. To help reduce wafer processing costs, a ceria slurry recycling process was developed using a reclaim unit from HighQ-Factory. Product wafers polished with a blend of the concentrated spent slurry and virgin ceria slurry produced equivalent post polish silicon nitride and oxide thicknesses...
A lidar-based approach of an emergency braking system for teleoperated vehicles is presented. Despite the time delay for the communication link of a teleoperated system, the vehicle has to be able to react to emerging objects in time. Starting with intelligent sensor data processing, reliable information is computed. An adapted particle filter algorithm tracks moving points to calculate their mean...
In an attempt to increase polisher throughput and reduce slurry costs at STI CMP, modifications to the HDP oxide deposition step were conducted. This was done after observing a reduced time to planarize a wafer with thicker oxide. Vertical scanning Interferometry was used to aid in understanding the wafer surface topography as a function of the HDP oxide deposition. Wafers deposited with 17000A of...
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