Ceria slurry used for polishing semiconductor wafers at the shallow trench isolation step has become very expensive. To help reduce wafer processing costs, a ceria slurry recycling process was developed using a reclaim unit from HighQ-Factory. Product wafers polished with a blend of the concentrated spent slurry and virgin ceria slurry produced equivalent post polish silicon nitride and oxide thicknesses to the standard 2-step, 2-slurry process. Microscratch defects were also reduced by 35% compared to wafers polished with the standard process. Based on the blending ratio, slurry costs were reduced by >50%.