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Cycle time requirements from prime or major customers contradict the ever-increasing complexity of wafer fabrication. Lot size variations show up as significant cycle time improvement potential for single wafer processes. Further reduction potential aside of process times is shown regarding tool-internal waiting times. A model is elaborated to assure cost efficiency while significantly reducing lot...
Customers demand more and more integrated functions on one chip; as a result, semiconductor product complexity is increasing tremendously. This development results in increasing production process complexity, reflected in the incorporation of additional lithography layers, for example, which causes longer cycle times, higher costs and extended feedback loops for making quality improvement. Each additional...
Customers demand more and more integrated functions on one chip. Therefore product complexity is increasing tremendously. This results in increasing production process complexity, reflected in additional lithography layers for example which causes longer cycle times, higher costs and extended feedback loops for quality improvement. Each additional process step requires at least five additional logistics...
In modern semiconductor manufacturing and primarily in high-mix-low-volume facilities it is increasingly important to ensure throughput and machine utilization requirements are met while satisfying tight goals in object tardiness at the same time. This is especially a challenge for the field of wafer test with its natural fluctuations and uncertainties of test times. A further important objective...
Manufacturing organization in the manner of flow production is one of the best solutions to achieve short cycle times, low inventories and a high delivery reliability, which are vital for commercial success. Variability within all production, support and organizational processes is one of the main detractors for establishing a continuous material flow in semiconductor manufacturing. In this contribution...
Bringing manufacturing excellence and innovation into balance, like yin and yang, in mature multi-product semiconductor fabrication facilities is the scope of the paper. This is done with the new approach called “Design for Flow by 3” which includes Product Process of Record (POR), Production Control, and organizational Design for Flow. It is derived out of the challenge to face the increasing pressure...
“Learning to see” is the message of the powerful Value Stream Mapping (VSM) technique, which was developed within the lean production paradigm to help practitioners redesign production systems, eliminate waste and create continuous flow manufacturing in a high-mix, low-volume manufacturing environment. It was originally developed mainly for disconnected flow lines of the automotive industry. In this...
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