The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
As the 3D interconnect density is increasing exponentially when scaling to lower levels of the interconnect wiring, we see that very soon 3D interconnect pitches of 5 μm and below will be required. Current 3D-SIC (3D-Stacked IC) technologies do not yet offer such interconnect densities and it is expected that most of the 3D-SOC (3D System On Chip) integration technology schemes will require a wafer-to-wafer...
Wafer-to-wafer 3D integration has a potential tominimize the Si thickness, which enables us to connectmultiple wafers with significantly scaled through-Si vias. Inorder to achieve this type of 3D structure, backside thinningis a key step. Conventional mechanical grinding is known asthe best way to remove bulk Si in terms of cost of ownership(CoO). However, mechanical damage such as induceddislocations...
One key challenge in the development of backside-illuminated CMOS imagers is to keep crosstalk low while enabling high quantum efficiency . In this paper, the tradeoff between and is optimized and demonstrated in two ways. First, a novel optimized two-step graded EPI was developed and implemented, giving excellent and data. Second, in other imagers, pixel-separating trenches were...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.