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A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.
Wire bond degradation is a limiting factor for the lifetime of state of the art power modules. So, there is a need for widely applicable and proven modelling techniques to achieve a reliable design. In this paper, a new crack growth law has been developed and calibrated with experimental data. By defining a failure criterion and optimizing model parameters, good lifetime predictions have been achieved...
In this study, an approach for enhanced lifetime modelling of wire bonds has been investigated. Numerical simulations of a 3D wire bond model have been used to acquire a suitable damage parameter. For the lifetime model, a modified Paris law for calculating crack growth per cycle has been employed, to consider the gradual area degradation due to thermo-mechanical loads. With the knowledge of the crack...
The embedding of ultrathin components in printed circuit boards has evolved into a production technology which is used worldwide. Many recent projects have shown the wide range of applications which include RF circuits and power electronics. The scope of this paper is to show the potential of using thermoplastic material, e.g. Polycarbonate, instead of FR4 by demonstrating the realization of a complex...
In this study possibilities are investigated to use the cohesive zone method for numerical calculation of fatigue crack growth through the interface area of aluminum thick wire bond joints. For that purpose a detailed three-dimensional model of a wire bond joint is built. Two approaches are investigated to describe the fatigue crack growth: explicit calculation of a large number of cycles and crack...
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