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This paper demonstrates an advanced 300mm 130nm BCD (Bipolar-CMOS-DMOS) automotive grade platform with high modularity. The platform offers logic-devices, flash-devices and high performance power devices with rated voltages up to 85V as well as complimentary analog devices such as a BJT, MIM and Poly Resistor. The power devices in the process have best-in-class specific on-resistance and wide safe...
The JERICO European research infrastructure (RI) is integrating diverse platform types such as fixed buoys, piles, moorings, drifters, FerryBoxes, gliders, HF radars, coastal cable observatories and the associated technologies dedicated to observe and monitor coastal European seas. The first steps of setting up, coordination and harmonization were done during 2011 to 2015 in the framework of FP7-JERICO...
The cellular frequency spectrum has become increasingly complex with over 50 frequencies in LTE standards. To reduce costs in the front end module the switch has migrated from a III–V PHEMT base to a silicon solution in RFSOI. While many providers have focused on a 180nm base technology node for the RFSOI there has been an increasing move to more advanced nodes to solution the logic requirements of...
Landscape of semiconductor technologies and manufacturing has been changing in general and RF technologies in specific from IDMs to foundries and from exotic III–V compounds to the silicon. Tremendous advantage of RF performance from nanometer technologies, exponential increase in scalability, availability of high resistivity and engineered SOI substrates have opened doors for the convergence of all...
Advanced mobile applications are the predominant driver for semiconductor technology innovations both at the leading edge and at the mature nodes. The short life-cycles of mobile products and the need for SoC level differentiation imposes significant challenges on technology architecture and time-to-volume. We foresee a move towards much closer collaboration, in fact a virtual IDM-like model, on both...
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