The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Photonic integrated circuits suffer from silicon microring's high thermal susceptibility, and therefore a heater based control is necessary. Towards an on-chip control circuit development, we report the design of two basic devices such as a MOS Operational Transconductance Operational (OTA) amplifier and a Finite State Machine (FSM). The devices were designed and manufactured in XFAB's 0.6 μm technology...
In this work we propose a packaging method for sub-circuit testing in a photonic integrated circuit (PIC). We demonstrate packaging of a chip with an integrated silicon-based microring modulators and a PCB with RF connectors are assembled for data communication applications. No degradation performance of the device was observed.
The paper presents a technological solution for high frequency packaging platform to at least 40 GHz. This approach is based on soft substrate processing. We present results of high frequency packaging of important building blocks, such as bias-T, transimpedance amplifiers. The paper demonstrates a solution for high-frequency hybridization that can be implemented with standard substrates.
A tunable microring resonator (MRR) with active p- and n-type doped regions is used for photodetection in photonic integrated circuits. We compare results of this device with that of an integrated Ge-photodetector (PD) connected to the MRR drop-port. A circuit containing both devices was designed and experimentally characterized. This device is an attractive alternative for applications such as a...
A set of low noise transimpedance amplifiers fabricated and characterized in CMOS and BiCMOS technologies are proposed in this work. Layout optimization, efficient modeling and bias point optimization are the techniques employed to reduce the input noise current density. The CMOS amplifiers were designed to work at 10 Gbps. The BiCMOS amplifiers, based on HBT transistors, can operate at bit rates...
This paper presents the characterization of silicon photonics active devices and a framework for the analysis of their application in high bit rates transceiver used for optical interconnection. System simulation of eye-diagrams that include measured S-parameters are shown for an optical link up to 25 Gb/s, including a SiGe transimpedance amplifier IC (TIA) developed at CTI. Considerations about the...
This paper presents the development of fiber arrays of single-mode fibers, describing the fabrication process of the silicon V-Grooves, fiber assembly procedures, the mechanical polishing process and physical/optical characterization. The optical coupling was evaluated for grating couplers @ 1550 nm fabricated in silicon ICs. The comparison with commercial fiber array is also reported.
Design guide lines are given for developing SiGe HBT mm-wave d.c. coupled ultra-wide-band low noise monolithic amplifiers. An ultra wide band LNA and two mm-wave TIAs for 40 Gbps and 100 Gbps applications are proposed. The LNA has S21=11 dB and a 3-dB bandwidth of 88 GHz. The 40 Gbps TIA has a new topology, allowing a DC coupled performance, 54 dBΩ transimpedance gain, 37 GHz bandwidth, consumes 59...
We present the current status of the photonic integrated circuit design initiative at CTI, sponsored by the IC-Brazil program. We use a multi project wafer approach with open-source software for layout and fabless approach for the fabrication of silicon photonic devices. The institutional platform implemented to support photonic IC design is described and initial results for the design and fabricated...
This paper presents the design of a WDM filter for three wavelength division multiplexing based on silicon photonics technology for ONT - GPON under development at CTI. The components are being fabricated in an external foundry of the Europractice consortium (IMEC). The results obtained are in compliance with the required specs for download and upload streaming.
We present an analysis of a wavelength monitoring system that employs a thermally tuned micro-ring resonator. The demodulation method is based on a time interval between peaks measurement. In order to evaluate this concept, a numerical simulation was executed based on a simple tuning model of the micro-ring resonator filter. Peak wavelength detection precision was determined using the Monte Carlo...
We extend our flexible probe approach to enable optical coupling into planar lightwave circuits (PLCs) in high-contrast silicon photonic platform. A flexible waveguide is used to form a variable length directional coupler that inserts/extracts light from a waveguide in the wafer to the probe. Varying the length enables optimal coupling to be achieved for a wide range of probe-to-waveguide gap, materials,...
A brief history of microelectronics in Brazil and the current policies are presented. The motivation and approach for transforming the federal government's key microelectronics research laboratory in an open access user facility are presented.
We present device applications for Nano-Opto-Electro-Mechanical System (NOEMS) structures based on the evanescent-wave bonding acting on silicon slot-waveguides. Useful alloptical or electrooptical functionalities include: phase modulation, polarization mode dispersion, near-field probing and reconfigurable optical delay.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.