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Historically, circuits that operate in a high-temperature region could cause an increase in the total delay (td) especially in the process technology prior to the 90nm node. This was because both interconnects and transistors were slowing down as the temperature rose. However, for transistors with the 90nm process technology and beyond, this phenomena has started to change. In particular, the threshold...
Recent submicron process technology scaling leads the urgency to build an efficient methodology of characterizing and modeling the process variation effect, for example, the threshold voltage, Vt. This is one of the key process parameters that must be extensively modeled and validated for accurate circuit performance. Furthermore, this requirement is even much more critical for analog applications...
This paper focuses on Negative Bias Temperature Instability (NBTI) awareness to the circuit designer for reliable design of the System-On-a-Chip (SoC) analog circuit. The reliability performance of all matched pair such as current source and differential pair circuits, such as Bandgap Reference, is at the mercy of aging differential. Aging simulation (AgingSim) is mandatory to obtain realistic risk...
Used materials, oxides thicknesses, and ultra-small channel lengths are contributors to the impact of well known reliability issue such as NBTI (Negative Bias Temperature Instability). This paper describes a case study using an Intra-Die Variation Probe (IDVP) test to screen out Infant Mortality (IM) failures. The approach is pursued by applying the learning of yield and reliability on 45 nm process...
This paper provides a working knowledge of Negative Bias Temperature Instability (NBTI) awareness to the circuit design community for reliable design of the System-On-a-Chip (SoC) analog circuit. The reliability performance of all matched pair circuits, such as Bandgap Reference, is at the mercy of aging differential. Aging simulation (AgingSim) is mandatory to obtain realistic risk evaluation for...
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