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The cost and the package size driven size reduction of semiconductors lead to much higher heat generation. Also the use of new high power technologies on the basis of SiC produces is a need for high conductivity of the interconnect materials. Therefore the requirements for mechanical, thermal and electrical properties of interconnect materials increase compared to existing eutectic solder and glue...
Within this paper, we present a guideline for the mechanical acceleration of reliability experiments for end-of-lifetime prognostics of metal based die attach materials. First, we used an advanced hybrid nano-effect sintered silver layer as interface between die and substrate which has very good electrical and thermal conductivities. Two pairs ofexperiment/simulation are scheduled. An isothermal mechanical...
New die attach technologies are necessary to meet the demand for faster and more reliable power electronic devices. Technologies based on sintering such as silver sintering and silver sinter adhesives are currently in the focus of technology development because of their high strength and very high thermal performance. To ensure the reliability of such a die attach reliable, fast and non-destructive...
The generation of meaningful lifetime-models is a serious and time-consuming challenge throughout the field of packaging. Wherever different materials are joined, the CTE mismatch will usually lead to thermo-mechanical fatigue due to the temperature cycles during the usage of the system [1–3]. As a result, the fatigue of interconnections is the limiting factor for reliability of electronic systems...
Through encapsulant vias (TEVs) are an interconnect technology which enables 3D stacking and double sided re-routing of packages encapsulated with epoxy molding compound. These interconnects are formed by Cu-plated holes through the encapsulant and can typically be routed by an RDL (redistribution layer). In order to enable prolonged function of these interconnects, thermo-mechanical reliability has...
Abstract Through encapsulant vias (TEVs) are an interconnect technology which enables 3D stacking and double sided re-routing of packages encapsulated with epoxy molding compound. These interconnects are formed by Cu-plated holes through the encapsulant and can typically be routed by an RDL (redistribution layer). In order to enable prolonged function of these interconnects, thermomechanical reliability...
In the first part of this study we reported the use of nanoindentation to evaluate the mechanical properties of microphases formed within Sn–Ag–Cu-based solder joints as a function of temperature. In this second part, the use of nanoindentation has been extended to study the creep behaviour of these phases in the temperature range 25–175°C. The data for nanoindentation creep has been compared with...
This paper introduces a miniaturized frictionless fan concept, which is similar to a piezo-electric driven fan principle. This type of fan has been employed for the enhancement of heat transfer by increasing the fluid circulation in regions which are otherwise stagnant.
Thermal interface materials (TIMs) are widely needed to improve thermal contacts for facilitation heat transfer in electronic packaging, such as that associated with the flow of heat from microprocessor to a heat spreader or a heat sink in a computer. Due to thermal mismatch between these components mechanical strain occur which cause pump-out, cracks or delamination of TIM. In order to qualify the...
The in-situ detection of failures in microelectronic packages in an experiment is still a big challenge. The reliability of most packages will be qualified by measuring the electrical resistance of daisy chain structures. The moment of failure in the electrical sig-nals or the changes in the resistance are used for reliability or lifetime estimations. But the correlation of electrical resistance in...
Interface fracture mechanics is one of the main focuses of electronics reliability research. Determination of fracture mechanical properties of interface cracks is a substantial task for design for reliability concept. Without experimental determined fracture mechanical parameters such as the critical energy release rate a reliability forecast based on simulation results cannot be given. In fracture...
The Stud Bump Bonding (SBB) flip chip technology on Molded Interconnect Devices (MID) is a highly promising solution to the increasing demand for reliable interconnection technology at high temperatures, a miniaturized assembly and a reduction of costs and parts.
As we face higher numbers of material layers in the increasingly complex Microsystems, the rating of layers reliability has to keep pace. Fracture mechanical descriptions are a big qualitative improvement when using simulation for design and reliability support, especially when looking at layer delamination. In order to simulate the interfacial fracture we urgently need to find empirical parameters,...
3-D technologies open a wide range of chip integration possibilities for microelectronic systems. Most of these technologies are using through-silicon vias (TSV). One disadvantage of this technology is the high investment for new equipment and processing cost for Si etching and metallization. The thin chip integration technology (TCI) presented in this paper is based upon existing WLP infrastrcuture:...
Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible...
This paper addresses the reliability of flip-chip on flex (FCOF) assemblies glued with an Ag-particle filled anisotropic conductive adhesive (ACA). As the description of FCOF failure gives still much scope for speculation, a physics of failure based approach is developed here, taking into account the changing thermo-mechanical properties of the ACA under temperature and moisture. A failure hypothesis...
The paper addresses the through silicon via (TSV) filling using electrochemical deposition (ECD) of copper. The impact of seed layer nature on filling ratio and void formation will be discussed with respect to via diameter and via depth. Based on the spherolyte Cu200 the electrolyte for the copper electrochemical deposition was modified for good filling behavior. Thermomechanical modeling and simulation...
The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is...
Higher reliability and miniaturization for automotive sensor applications are more and more demanded. These sensors are exposed to harsh environments like extreme temperatures, fast temperature change and humidity. Flip chip interconnections using the stud bump bonding (SBB) technology provide a solution to fulfil these demands and requirements. For SBB interconnections, the failure modes during reliability...
It is necessary to improve the lifetime prediction based on FE-methods of different electronic packages in order to reduce the time and costs of new developments. This paper purposes a method describing the crack propagation of chip on copper substrate solder joints. The chips that were studied are power transistors. They were soldered on copper substrate (NiAu metallization) with two different solder...
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