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With more implementation of LED in lighting and communication applications, increasing demand for function enrichment and miniaturization has emerged. Existed technologies are highly challenged. System-in-package (SiP) technology is very promising in terms of function integration and cost reduction. In this paper, a novel SiP platform for LED system with integrated driver and wireless control function...
Silicon interposer is an emerging and promising technology for 3D integration of LED systems. In this paper, the thermal performance of silicon interposer is investigated through finite element analysis (FEA). Different approaches of silicon integration are evaluated: double-side interposer and double-layer interposer. The effect of thermal interface material (TIM) on the junction temperature of LEDs...
Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new intermetallic compound (IMC) will form at the...
As the market demands for high power and high efficiency power electronics, the industries has developed advanced IC technology and conceptual configuration. However, in order to guarantee the performance and reliability of the power electronics, the challenge of the packaging arises.
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