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In 2006, the European Union restricted lead (Pb) to > 0.1% (by weight) in electronics. This caused a renewal of interest in Sn whiskers, as the absence of Pb in Sn films had been known for years to promote Sn whisker growth. The early work on Sn whiskers had suggested that elements other than Pb may suppress whiskers. Bi was chosen as an attractive candidate, as it has similar phase formation behavior...
Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantification of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system...
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, the material behavior changes occurring in flip chip underfill encapsulants (silica...
Solder materials demonstrate evolving microstructure and mechanical behavior that changes significantly with environmental exposures such as isothermal aging and thermal cycling. These physical aging effects are greatly exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In the current study, mechanical measurements of thermal...
Methodologies for prognostication and health monitoring can significantly impact electronic reliability for applications in which even minimal risk of failure may be unbearable. Prognostics health-monitoring (PHM) approach presented in this paper is different from state-of-art diagnostics and resides in the pre-failure-space of the electronic-system, in which no macro-indicators such as cracks or...
Solder materials demonstrate evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such physical aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, measurements of thermal aging induced material behavior evolution have been performed...
Electronic assemblies are approximately "stress free" near their assembly temperature, which is typically above 150 degC when encapsulants and solders are involved. As the assemblies are cooled below room temperature, the temperature difference between ambient and "stress free" conditions becomes extremely high, and the thermal expansion mismatch induced stresses, strains, and...
Silica filled epoxy encapsulants used for microelectronic packaging are known to exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Most aging effects are typically exacerbated at higher temperatures at or above the glass transition temperature (Tg) of the encapsulant. Such extremes are often used during the high temperature...
The thermal performance of ball grid array packages depends upon many parameters including die size, use of thermal balls, number of perimeter balls, use of underfill, and printed circuit board heat spreader and thermal via and spreader design. Thermal cycling can affect the integrity of thermal paths in and around the BGA as a result of the cracking of solder balls and delamination of the package,...
Solder materials demonstrate evolving microstructure and mechanical behavior that changes significantly with environmental exposures such as isothermal aging and thermal cycling. These aging effects are greatly exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In the current study, mechanical measurements of thermal aging...
Solder materials demonstrate evolving micro structure and mechanical behavior that changes significantly with environmental exposures such as isothermal aging and thermal cycling. These aging effects are greatly exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In the current study, mechanical measurements of thermal aging...
In this work, we report on our efforts to develop ultra-high reliability flip chip on laminate assemblies for deployment in harsh thermal cycling environments characteristic of ground and aerospace vehicles (e.g. -55 to 150 degC). Reliability enhancement has been achieved through the use of a novel low expansion, high stiffness, and relatively low cost laminate substrate material that virtually eliminates...
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