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In the present study, chemical dicing methods were developed as an alternative solution for thin silicon chips separation. Dicing streets were fabricated by wet and dry etching. The dry etching approach is reliable but also an expensive process. On the other hand, the wet etching approach offers a faster and low-cost process compared with the dry etching approach. However, serious undercutting usually...
In this paper, a stopper mechanism is introduced to control the length of the epoxy flow in the V-grooves. In fact, such a stopper is another V-groove which is perpendicular to the V-grooves for passive fiber alignment. During the fabrication of prototypes, one critical issue was identified. Due to the undercutting of wet etching, the right angles at the intersection of the stopper and alignment V-grooves...
Solder is a very common and important material for electronic packaging. The major function of the solder is to provide the electrical connection between different electrical components. In SMT assemblies, solder also provides the mechanical support. Self alignment property of solder joints is one of the advantages of using solder as the interconnection materials in SMT process. It can pull the initially...
Legislation that mandates the banning of lead (Pb) in electronics due to environmental and health concerns has been actively pursued in many countries during the past fifteen years. Lead-free electronics will be deployed in many products that serve markets where the reliability is a critical requirement. Although a large number of research studies have been performed and are currently under way in...
In electronic packaging industry, solder is a very important material which mainly provides the electrical connections between two different components. Also it gives mechanical support between the package and the substrate. In SMT process, the self alignment capability of solder during the reflow process pulls the initially misaligned components back to the desired position. This capability benefits...
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