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Controlled collapse chip connection - new process (C4NP) technology is a novel solder bumping technology developed by IBM to address the limitations of existing bumping technologies. Through continuous improvements in processes, materials and defect control, C4NP technology has been successfully implemented at IBM in the manufacturing of all 300 mm Pb-free solder bumped wafers. Both 200 mum and 150...
Controlled collapse chip connection new process (C4NP) is currently used in IBM manufacturing for all 300 mm Pb-free wafer bumping for flip chip packages. In this study, the extendibility of C4NP technology to ultra fine pitch applications has been explored. Reusable C4NP glass molds were fabricated and characterized for 50 mum pitch application. Mold fill and wafer transfer with Pb-free solders have...
Semiconductor packaging continues to migrate from wire bond to flip chip first level interconnect to meet aggressive size, weight and electrical performance requirements. In addition, novel System in Package (SiP) approaches utilizing 3D packaging technologies and fine-pitch chip to chip interconnection schemes require advanced lead-free solder bumping technologies. Today, solder electroplating is...
Technology roadmaps for electronic packaging and 3D integration show the continuing trend of increasing input/output connection density between the semiconductor chip and the package or between two different IC's. For FlipChip packaging applications, 150 mum pitch full grid solder bump arrays have already entered production. Bump pitch requirements for 3D applications such as the integration of memory...
This paper analyzes electroless Ni/immersion Au (ENIG), with and without Pd, as an alternative UBM structure. Wafers were fabricated with these UBM structures, solder applied with C4NP, and chip level stressing performed to determine the robustness of these alternative stack-ups. Analysis of these structures following multiple reflows and thermal cycling is presented. In addition, the paper also reviews...
To meet nature requirements for cost, size, weight and electrical performance, microelectronic packaging is moving from wire bonds to solder bumps as the preferred method of interconnection from the device to the chip carrier or card. Flip chip in package (FCiP) requires many small bumps on tight pitch whereas wafer level chip scale packaging (WLCSP) typically requires much larger solder bumps on...
C4NP (C4-New Process) is a novel solder bumping technology developed by IBM and commercialized by Suss MicroTec. C4NP addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free solder alloys. C4NP is a solder transfer technology where molten solder is injected into pre-fabricated and reusable glass templates (molds). The filled...
More and more high-end microelectronic devices are being packaged by using solder bumps as the method of interconnection. The two main technologies are flipchip in package (FCiP) and wafer level chip scale package (WLCSP). The main difference is that FCiP devices are placed on a substrate which then interconnects to the PC board (PCB). WLCSP devices connect directly onto the board. There are various...
To meet future requirements for cost, size, weight and electrical performance, microelectronic packaging is moving from wire bonds to solder bumps as the preferred method of interconnection from the device to the chip carrier or card. Flip chip in package (FCiP) requires many small bumps on tight pitch whereas wafer level chip scale packaging (WLCSP) typically requires much larger solder bumps on...
More and more high-end microelectronic devices are being packaged by using solder bumps as the method of interconnection. The two main technologies used are flipchip in package (FCiP) and wafer level chip scale package (WLCSP). The main difference is that FCiP devices are placed on a substrate which then interconnects to the PC board (PCB). WLCSP devices connect directly onto the board. C4NP (C4-new...
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