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Controlled collapse chip connection - new process (C4NP) technology is a novel solder bumping technology developed by IBM to address the limitations of existing bumping technologies. Through continuous improvements in processes, materials and defect control, C4NP technology has been successfully implemented at IBM in the manufacturing of all 300 mm Pb-free solder bumped wafers. Both 200 mum and 150...
Detailed observations of the impact of various process parameters on the fracture of brittle structures in low-k dielectric flip chips assembled on organic laminates using lead-free metallurgies are reported. Specifically, a simple model is first presented to evaluate the stresses transmitted to the chip back end of line structures which are susceptible to failure during the reflow at chip joining...
Semiconductor packaging continues to migrate from wire bond to flip chip first level interconnect to meet aggressive size, weight and electrical performance requirements. In addition, novel System in Package (SiP) approaches utilizing 3D packaging technologies and fine-pitch chip to chip interconnection schemes require advanced lead-free solder bumping technologies. Today, solder electroplating is...
To meet nature requirements for cost, size, weight and electrical performance, microelectronic packaging is moving from wire bonds to solder bumps as the preferred method of interconnection from the device to the chip carrier or card. Flip chip in package (FCiP) requires many small bumps on tight pitch whereas wafer level chip scale packaging (WLCSP) typically requires much larger solder bumps on...
More and more high-end microelectronic devices are being packaged by using solder bumps as the method of interconnection. The two main technologies are flipchip in package (FCiP) and wafer level chip scale package (WLCSP). The main difference is that FCiP devices are placed on a substrate which then interconnects to the PC board (PCB). WLCSP devices connect directly onto the board. There are various...
To meet future requirements for cost, size, weight and electrical performance, microelectronic packaging is moving from wire bonds to solder bumps as the preferred method of interconnection from the device to the chip carrier or card. Flip chip in package (FCiP) requires many small bumps on tight pitch whereas wafer level chip scale packaging (WLCSP) typically requires much larger solder bumps on...
More and more high-end microelectronic devices are being packaged by using solder bumps as the method of interconnection. The two main technologies used are flipchip in package (FCiP) and wafer level chip scale package (WLCSP). The main difference is that FCiP devices are placed on a substrate which then interconnects to the PC board (PCB). WLCSP devices connect directly onto the board. C4NP (C4-new...
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