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In this paper, we present a highly scaled bulk metal-oxide-semiconductor field-effect transistor with block oxide (BO) and source/drain (S/D)-tied structure that meets the International Technology Roadmap for Semiconductors requirements for high-performance devices. This new device requires only a simple BO fabrication process using SiGe-Si epitaxial growth with selective SiGe removal and requires...
This paper proposes a new self-aligned process to form the silicon-on-insulator with block oxide. Based on the TCAD simulation, we have proved that the new process can get excellent short-channel effects immunity compared to the previous process [1]. Also, the new process can overcome the problem of the previous one, which can not be used on the thin BOX devices, so that the application of the block...
In this work, a novel fully depleted silicon-on- insulator MOSFET with block oxide (bFDSOI) is proposed to investigate the influence of Si-body thickness on the characteristics of the device. Based on the two-dimensional (2-D) simulation results, the proposed structure exhibits better ultra-short-channel behavior such as reduced drain-induced barrier lowering (DIBL) and better subthreshold swing when...
In this work, the investigation of block oxide used in planar MOSFETs has been studied. To solve these above issues and for the comparison, we propose two novel device architectures; one is called the FDSOI with block oxide (bFDSOI) and the other is called the Si on partial insulator with block oxide field-effect transistor (bSPIFET)
This paper is submitted with an investigation concerning the effects of the Si thickness-induced variation of the electrical characteristics in the FDSOI with block oxide. We noticed that the traditional sidewall spacer process is used and processed to produce the block oxide enclosing the Si-body in our proposed structure, the undesirable ultra-short-channel effects can be significantly diminished...
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