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With the shrink of TSV diameter, smoothness of side wall and taper angle control become more and more important. We have developed scallop free etching by direct etching method. Direct etching method is continuous, not cyclical etching and deposition. Scallop does not occur in principle. Double ICP antenna newly developed has good controllability of side wall taper angle.
"2.5D silicon interposers" and "Hetero 3D stacked" technology for high-performance LSI are gathering the most attention from now on. These technologies can solve interconnection problems using TSV (Through Silicon Via) to electrically connect stacked each function devises. 2.5D and hetero-3D Si integration has great advantages over conventional 2D devices such as high packaging...
Through-silicon-via (TSV) process of which process temperature is less than 180 degree C (°C) has been accomplished by using ZrBO dielectric film and WN barrier film. Integration of ZrBO and WN, both being Carbon free, capable to deposit at low temperature and showing high barrier performance, would result in high reliability in Cu interconnect. The diameter of 5μm (Φ5μm) TSV was formed by anisotropie...
In recent years, control system reliability has received much attention with increase of situations where computer-controlled systems such as robot control systems are used. In order to improve reliability, control systems need to have abilities to detect faults (fault detection) and maintain the stability and the control performance (fault tolerance). In this paper, we address the stain gauge sensor...
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