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For high demand of large bump density, fine pitch micro Cu bumps are usually connected to trace on the substrate by flip chip technology. In this study, TCNCP (Thermal Compression Bonding with Non-Conductive Paste) method was used to attach die Cu pillar onto substrate trace with surface finish of thin Ni and thick Au in a flip chip package. The micro Cu bump used in the device under test had a dome...
Recently, TCNCP (Thermal Compression with Non-Conductive Paste) flip chip technology has been adopted for various devices because of high demand for large bump density. Fine pitch micro Cu bumps are usually connected to trace on the substrate (Bump on Trace, BOT) due to space limitation on substrate. In this study, TCNCP technology was used to attach die onto substrate trace with surface finish of...
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