The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this work, we present ball impact test (BIT) results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu- 0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.
The authors derive in this paper equations of motion of board-level electronic packages subjected to swept sine vibration loads following the support excitation scheme. A single degree of freedom elastoplastic structural system is constructed to benchmark multi-step harmonic analysis schemes proposed in this study. Applications of the harmonic analysis schemes to calculating response spectra of a...
The objective of this research is to investigate the effects of board-level drop test based on the support excitation scheme incorporated with the submodel technique for stacked-die packages. This paper also demonstrates the transient dynamic response for lead-free SAC405 (95.5Sn4Ag0.5Cu) solder balls subject to JEDEC pulse-controlled board-level drop test standard JESD22-B110A Condition B. To evaluate...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of nine Sn-Ag-Cu solder compositions...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around intermetallics, similar to that from a board-level drop test. We investigate numerically in this paper the effect of yield stress variations of solder alloy on transient structural responses of a single package-level solder...
With the RoHS deadline approaching by July 1, 2006, many manufacturers are aggressively eliminating the use of lead in consumer electronic products. However, the development of lead-free products requires close cooperation between end-product manufacturers and component manufacturers because metallurgies, resin materials, reflows conditions and moisture resistance will be influenced. The increase...
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of different Sn-Ag-Cu compositions...
Package-level ball impact test and board-level drop test are performed and correlated empirically using a specific chip-scale package with solder joints of different Sn-Ag-Cu solder compositions. A positive correlation is found between characteristics of the impact force profile and reliability from the drop test, which provides a supporting basis for the package-level ball impact test to serve as...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.