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As the trend of smaller and higher density packaging technology developing, the wafer-level chip scale package (WLCSP) is becoming the popular choice for device assembly. While many high performance chip often with high power, the power dissipation through the chip also leads to higher die temperatures. With the redistribution layer of the WLCSP getting more narrow and thinner, in order for the devices...
We present in this paper a new interconnect-driven multilevel floorplanner, called interconnect-driven multilevel-floorplanning framework (IMF), to handle large-scale building-module designs. Unlike the traditional multilevel framework that adopts the ldquoLambda-shapedrdquo framework (inaccurately called the ldquoV-cyclerdquo framework in the literature): bottom-up coarsening followed by top-down...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
With the RoHS deadline approaching by July 1, 2006, many manufacturers are aggressively eliminating the use of lead in consumer electronic products. However, the development of lead-free products requires close cooperation between end-product manufacturers and component manufacturers because metallurgies, resin materials, reflows conditions and moisture resistance will be influenced. The increase...
Package-level ball impact test and board-level drop test are performed and correlated empirically using a specific chip-scale package with solder joints of different Sn-Ag-Cu solder compositions. A positive correlation is found between characteristics of the impact force profile and reliability from the drop test, which provides a supporting basis for the package-level ball impact test to serve as...
This paper is concerned with constructing a high-G drop impact test condition for investigating the impact induced failure phenomenon of the solder ball array located in the chip packaged printed circuit board. An impact environment satisfying the JEDEC B service conditions was constructed using an instrumented drop tower tester. Fifteen wafer-level CSP chips were installed on a standard printed circuit...
Transient structural responses of a board-level chip-scale package subjected to consecutive drops are investigated in this paper using a numerical methodology based on the support excitation scheme and incorporated with the implicit time integration scheme. Evolutions of stresses, plastic strains, and plastic strain energies in the solder joints under repetitive drop impacts are examined and correlated...
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