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The fabrication of precise hemispherical shape is challenging with standard planar lithography techniques. A suitable alternative is the fabrication by inkjet printing. This paper presents a method based on drop-on-demand inkjet printing on pre-patterned silicon substrates allowing the controlled fabrication of SU-8 hemispherical cup-like structures with inner cavities of sub-nano-liter volumes. Examples...
We demonstrate a novel concept for nanostencil lithography with an integrated microhotplate on the stencil membrane aimed at eliminating or reducing aperture clogging during metal deposition. The stencil can be locally heated up by the embedded Pt coils to more than 700 °C in order to minimize materials' accumulation on the membrane. FEM simulation was carried out to predict the temperature distribution...
We present an analysis on the blurring, electrical and optical properties of nanostructures fabricated by stencil lithography and their application for biomolecular sensing. We analyze the effect of the stencil-substrate gap on the blurring, then we present the fabrication and electrical characteristics of nanowires on plastic substrates, and finally, we demonstrate the application of nanodots for...
This work reports on advanced stencil lithography using compliant membranes. Compliant membranes are mechanically decoupled from a rigid silicon frame by means of four non planar cantilevers. Compliant membranes are protruding parts which adapt to the surface independently in order to reduce the gap between a membrane and its substrate. FEM simulations show that compliant membranes can vertically...
A nanoelectromechanical mass sensor based on a submicron size resonating metallic beam is used to characterize material deposition rates in stencil lithography. The material flux through micron size apertures is mapped with high spatial (below 1 mum) and deposition rate (below 10 pm/s) resolutions by displacing stencil apertures above the sensor. It is discussed how the sensor can be used as a test...
This paper reports the feasibility of the fabrication of high aspect ratio structures on substrates via dry etching through a stencil mask placed onto the sample. It demonstrates the possibility to use standard equipment and processes with this novel masking technique, which allows the patterning of fragile and pre-structured surfaces, and avoids the use of resist or additional coating of the sample,...
A nanoelectromechanical mass sensor is used to characterize material deposition rates in stencil lithography. The material flux through micron size apertures is mapped with high spatial (below 1 mum) and deposition rate (below 10 mum/s) resolutions by displacing stencil apertures above the sensor. The sensor is based on a resonating metallic beam with submicron-size width and thickness. The beam is...
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