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Fan-Out Wafer Level Packages (FOWLPs) and Fan-Out Panel Level Packages (FOPLPs) have been proposed for promising candidates of the advanced packages for multifunctional LSI with many I/O (input/output). FOPLP is expected to reduce the cost of FOWLP by improving the productivity per substrate. Dielectric materials for redistribution layers (RDLs) are one of the most important materials for FOPLPs....
High thermal conductive adhesive is important to cool power devices. Recently thermal conductivity reaches more than 10W/mK by efficient addition of thermal conductive filler. However, high loading of filler makes the thermal conductive sheet poor adhesion. Furthermore, we focused on reducing an interfacial heat resistance between high thermal conductive sheet composed of resin and heat conductive...
Positive tone Photosensitive Polyimide B-stage sheet which was composed of transparent soluble polyimide, naphthoquinone diazide compound, thermal cross linker and solvent, was developed. We designed new polyimide structure and cross linker suitable for photosensitive polyimide sheet. The photosensitive sheet shows fine pattern formation capability as well as good thermal stability and mechanical...
Novel Non Conductive Film (NCF) was developed for high productivity process. To meet high productivity, we add viscosity stability on a hot stage and snap cure property at higher than 140C. In addition, the NCF is transparent for optical alignment process.
We found that positive-tone photosensitive polyimide (posi-PSPI) shows not to be compatible for electroless Ni/Au plating process which are used for Au micro bumping. In order to meet compatibility for the process, we improved chemical resistance of positive-tone photosensitive polyimide especially for electroless plating process. Changing of polyimide polymer structure is most effective to obtain...
A series of new, substituted pyromellitic dianhydrides were synthesized from 1,2,4,5-tetramethylbenzene. New soluble rigid-rod polyimides were obtained from the dianhydrides and 2,2 -bis(trifluoromethyl)-4,4 -biphenyl (PFMB) in phenolic solvents in the presence of isoquinoline as a catalyst. The polyimides are soluble in N-methyl-2-pyrrolidone (NMP),N,N -dimethylacetamide (DMAc), m-cresol and...
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