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An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated...
We report the implementation of a transimpedance amplifier (TIA), using the combination of the shunt-feedback topology with the regulated-cascode input stage and broadband matching network, in a 0.13 µm CMOS technology. The proposed TIA achieves a 3-dB bandwidth of 7.5 GHz, transimpedance gain of 50 dBΩ in the presence of 300 fF photodiode capacitance, a gain-bandwidth product per DC power figure...
A bidirectional optical transceiver integrated with a novel transmission envelope detector for controlling the transmitting direction automatically is proposed. The transmission envelope detector detects the present of received signals to generate the directional controlling signals. Implemented in a 0.18 mum CMOS technology, the bidirectional optical transceiver occupies an area of 1.08 mm2 and dissipates...
An electrical/optical (E/O) module integrated with a combined transmitter/receiver (Tx/Rx) and multiplexer/demultiplexer (Mux/Demux) is proposed. With this topology, a high efficient bidirectional optical link can be implemented in the term of saving power consumption, chip area, board area as common blocks are shared between Tx and Rx as well as Mux and Demux. Based on this topology, a design of...
A bidirectional transceiver (Bi-TRx) integrated with a novel transmission envelope detector, which can detect the presence of received signals to generate a mode control signal automatically, is proposed in this letter. Implemented in a 0.18-mum complementary metal-oxide-semiconductor technology, the Bi-TRx occupies an area of 1.08 mm2 , and dissipates 42 and 49 mW in transmitter (Tx) and receiver...
A bidirectional optical transceiver with an automatically directional controlling function is designed and implemented in a 0.18 mum CMOS technology. A novel transmission envelope detector functions as the directional controlling block to generate the controlling signals according to the received optical signal. The bidirectional optical transceiver achieves a 3-dB bandwidth of 4.4 GHz and 4 GHz in...
Signal latency between optical and electrical interconnections is modeled and evaluated. As interconnection length is increased latency is also increased and signals become asynchronous. To compensate this latency, a signal synchronizing block which can synchronize the asynchronous signal according to clock signal is proposed and designed in this paper. This synchronizing block is consists of D flip-flop,...
A new charge pump (CP) with perfectly current matching and less sensitive to power supply noise is proposed for charge pump-phase locked loops (CP-PLL) in chip-to-chip optical link. The difference of charged/discharged currents in the proposed CP is less than 1% over a wide CP output voltage range in a 0.18 mum CMOS technology.
A novel all-digital phase-locked loop (ADPLL) is proposed and designed for chip-to-chip optical interconnect applications. The ADPLL is designed using the TSMC 0.18 mum CMOS technology. The core size of the ADPLL is 550times1040 mum2. The frequency range of the ADPLL is 3.0 - 3.4 GHz and power consumption is 18.67 mA with 1.8 V supply voltage.
Chip-to-chip optical and electrical interconnects have been compared to evaluate signal latencies and a novel compensation block for signal latencies is proposed in this paper using a master slave (MS) flip-flop and a delay circuit. The MS flip-flop is designed by using a new high speed latch topology that provides satisfactory performance up to 10 GHz in a commercial 0.18-mum CMOS technology.
For bidirectional optical link at 2.5 Gb/s, we designed and fabricated a driver-receiver combined CMOS transceiver in 0.18-mum technology, an optical connector, and an optical PCB. The CMOS transceiver provides both transmitting and receiving modes of operation on a single chip, showing -3-dB bandwidths of 2.2 GHz and 2.4 GHz, and small-signal isolations of -28 dB and -40 dB between operating modes,...
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