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In technology of electronic packaging, demands of miniaturization and high-density in electronic systems has sustainably grown. Therefore, it have been required to develop the technology of three dimensional (3D) stacking using through silicon via (TSV) Technology. The TSV technology is an interconnection method by filling an electric conductive material in via hole after via formation. Cu as a filling...
Joint properties of Au stud bumps joined with Sn-3.5Ag solder by flip chip bonding were investigated. Au stud bumps were bonded on SOP (solder on pad) at bonding temperature of 260°C and 300°C for 10sec, respectively. Aging treatment was carried out at 150°C for 100 and 300 hrs. After flip chip bonding, intermetallic compounds (IMCs) of AuSn, AuSn2, and AuSn4 were formed at interface between Au stud...
In this paper, we present a novel method for gait recognition of different people groups based on Fourier descriptors (FDs) and support vector machine (SVM). The proposed method involves the procedures of background modeling, extraction of gait silhouettes by background subtraction, shadow removal, representation of gait silhouettes using the FDs, and recognition of human gaits by an SVM Classifier...
The benefits of using the low Ag solder in CSP package has been known in terms of the performance due to its intrinsic characteristic. In this study, SAC alloy dopanted D1 and D2 are selected to compare with the general solder alloy, SAC105, in terms of thermal fatigue fracture performance. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB treated with 150 C thermal aging at different period...
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package. The result shows the strain-controllable dynamic bending method can...
The benefits shown in the reliability performance when using the low Ag solder in BGA package has been known due to its intrinsic characteristic. In this study, SAC alloy with the dopant D1 and D2 respectively are selected to compare with the widely-used solder alloy, SAC105, from the perspective of the thermal fatigue fracture. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB pre-treated at...
The benefits of using the low Ag solder in CSP package has been known in terms of the performance due to its intrinsic characteristic. In this study, SAC alloy dopanted D1 and D2 are selected to compare with the general solder alloy, SAC105, in terms of thermal fatigue fracture performance. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB treated with 150°C thermal aging at different period...
This paper proposes a coarse-grained dynamically reconfigurable architecture, which offers flexible reliability to soft errors and aging. A notion of cluster is introduced as a basic element of the proposed architecture, each of which can select four operation modes with different levels of spatial redundancy and area-efficiency. Evaluation of permanent error rates demonstrates that four different...
By means of 0.25 mum, 0.4 mum and 0.5 mum-thick i-GaN layers, we have successfully proved the reliability of nitride-based p-i-n photodetectors (PDs) was highly sensitive to the thickness of intrinsic GaN layers. After current aging, the p-i-n PDs with thin i-layer exhibited a poor electrical strength.
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