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With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered...
The benefits of using the low Ag solder in CSP package has been known in terms of the performance due to its intrinsic characteristic. In this study, SAC alloy dopanted D1 and D2 are selected to compare with the general solder alloy, SAC105, in terms of thermal fatigue fracture performance. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB treated with 150 C thermal aging at different period...
The major purpose of the mechanical stress screening is to screen out the products which have potential defects which lie in materials, design, process, and operation etc. If the screening is thorough before the products are shipped, the rate of the abnormal failure at the users' side can be eliminated or lowered significantly. The manufacturing lot which goes through appropriate screening will have...
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package. The result shows the strain-controllable dynamic bending method can...
With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered...
The benefits shown in the reliability performance when using the low Ag solder in BGA package has been known due to its intrinsic characteristic. In this study, SAC alloy with the dopant D1 and D2 respectively are selected to compare with the widely-used solder alloy, SAC105, from the perspective of the thermal fatigue fracture. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB pre-treated at...
The benefits of using the low Ag solder in CSP package has been known in terms of the performance due to its intrinsic characteristic. In this study, SAC alloy dopanted D1 and D2 are selected to compare with the general solder alloy, SAC105, in terms of thermal fatigue fracture performance. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB treated with 150°C thermal aging at different period...
In this paper, we are interested in the Halogen-free (HF) impact on the reliability performance of portable electronic devices. Due to the trend of environment protection, the Halogen-free materials of solder paste, molding compounds, PCB and etc. have been widely discussed. When the material changes happen, the transition of failure modes in the board level can be expected, and the challenges are...
A strain-controllable dynamic bending method on WLCSP has been proposed in this paper. In order to identify the principle factor among the effects of stiffness attributed by different board level structures, the 0.4 mm pitch WLCSP packages with Sn-4.0Ag-0.5Cu solder ball are used. This combination of WLCSP is considered to have the high stiffness in the structure. It is also shown that there are interactions...
In this paper, a new application of 4-point cyclic bending test for the solder joint reliability evaluation is discussed. In light of the long cycle time of thermal cycle testing, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. The 4-point cyclic bending test is considered a good candidate in this study. The thermal cycle test and 4-point...
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