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With the introduction of new material (e.g., ultra-low-K inter-metal dielectrics) and package technology (e.g., laser grooving), there are new challenges on product reliability, especially on environmental stress tests related to film adhesion. To better understand the impacts of these changes on field applications, a new evaluation method, the die pull (DP) test, was proposed to assess the inter-layer...
With the new BEOL scheme or package technology introduced, the chip and package interaction effect gets more and more concerns and focuses especially for most advanced technologies. To well reflect the impacts of these effects on the real product application performance, a new method of die pull (DP) test is proposed to evaluate the chip internal layer performance for a semiconductor device after...
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