Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
The demand of LiTaO3 (LT) wafer mainly used as substrate of SAW (Surface Acoustic Wave) filter device has been quite increasing in recent years. From the viewpoint of LT wafer's productivity in the polishing process, high removal rate and good recycle stability are required for slurry to eliminate generated damages in the previous process. In this study, the effect of pH and particle size in the slurry...
In this paper a simple approach is demonstrated for spatially selective etching of a silicon nitride layer by Reactive Ion Etching (RIE) by using a reusable shadow mask as a separate solid component part. Two ceramics were applied as mask materials: aluminum oxide and boron nitride. After the usage of an aluminum oxide mask several times, the deposition of small aluminum fluoride particles is observed...
We developed an Advanced Fault Detection Method by monitoring motor current for Chemical Mechanical Polisher (CMP) in order to prevent many troubles caused by no contact faults of pad dresser. We considered detection method by monitoring motor current theoretically, and verified the consideration by measurement results of mass production CMP. Furthermore, we succeeded in detecting the faults in two...
This study has demonstrated how to apply datamining technics, Neural Networks (NNs), to estimate the power consumption (kilowatt hour per move, kwh/move) of individual process tool sets in a semiconductor factory, and to analyze the relationships between kwh/move and 19 individual input factors, which included “lot size”, “process time”, “uptime”, “usable machine”, “Q-time constrain”, “sampling rate”...
In this paper a correlation between specific inline and electrical parameters related to erase threshold voltage has been deeply investigated. This study shows the impact of the WL roughness on a NOR flash memory performances. A process recipe optimization and Run to Run feed-forward controller have been evaluated to keep the process in control.
We have developed a novel simulator for chemical mechanical planarization processes, based on the one variant of Monte-Carlo method. It implemented the several input parameters: pressure, diameters of abrasives, temperature, linear velocity of abrasives, and easiness to remove materials. This simulator reproduced the linear change in the amounts of the polished portions of materials with pressure*linear...
The coupling of process control and production scheduling will grow tight in future fab and products. Such a trend requires integration to reduce fab cost and to improve fab effectiveness in terms of product yield and throughput performance. By focusing on the individual tool productivity, this research proposes Generalized Overall Equipment Effectiveness (GOEE). The generalization first develops...
A motion capture technique was developed to record a worker's motion during preventive maintenance, especially during the wiping process of wet cleaning. The time-series three-dimensional coordinal data of a worker's hand was successfully obtained with a motion capture sensor, and three different possible movements were distinguished. In addition, the data was correlated with the change in the number...
Improving the process tool productivity, in other words reducing the cost in semiconductor manufacturing is a constant way of life and reducing cost of consumables (CoC) is just one of many ways in which the industry can become more competitive and hence, more profitable. The seal type or material is an integral part of this cost equation. In this paper, a comprehensive study has been carried out...
As part of the study to investigate filter performance in the actual conditions, particle removal efficiency evaluation method of filters in isopropyl alcohol was developed. Three kinds of particles which exhibit each different charged state in the chemical, and the sizes of which are around 10 nm, were selected as test particles for the evaluation. Pall 10-nm-rated surface-modified PTFE membrane...
Isopropyl alcohol (IPA) has been commonly used for drying wafers at a final step of cleaning process. As a result, the demand for higher purity IPA has been increasing, and the quality control of metallic impurities in IPA using the reliable analytical method is required. In this study, issues on the analysis of metallic impurities in IPA at ultra-trace level were investigated, and some accurate analysis...
Floating gate material plays a significant role in the performance of Electrically Erasable Programmable Read-only memory (EEPROM). In this work, three types of floating gate Si materials were utilized for fabricated EEPROM cells. In-situ doped amorphous Si shows better high temperature data retention (HTDR) performance than both poly crystalline Si and amorphous Si with post-deposition implantation...
4H-SiC substrate samples were etched on the surface in order to alter the surface stoichiometry, to make the surface carbon rich using solutions of HF/Ethyl Glycol and HF/H2O. The samples were inspected with AFM, XPS, Raman and electrically (current - voltage) tested by applying probes across two contacts each sample. The results show that in comparison to the unetched samples, the current through...
Negative tone imaging (NTI) is a method for obtaining a negative-tone reversal pattern by developing with an organic solvent. As NTI process can break-through the resolution limit of a conventional positive-tone development (PTD) process, it has been applied for mass production in 20nm and 14 nm nodes device. In this paper, we examined the possibility of a bi-layer process using novel Si-containing...
In this study, we investigated the plasma-induced damage in silicon trench etching. The damage was measured by detecting the dark current, which was a very small leakage current thermally generated from silicon crystal defects. The results indicated that both the amount and depth of the sidewall damage in the trenches were almost the same as those of the bottom damage. From the results of analysis...
It is important for the Y2O3 film on the inner walls of RIE chambers to have small particle size and a smooth surface. By using CASP to form Y2O3 films on the inner wall of the chamber in this evaluation, particle generation was decreased by 67% compared with conventional APS.
Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control. Methods for detection of airborne and surface molecular contaminants were enhanced to meet the increasing requirements for future More Moore and More than Moore applications. Improved qualitative and quantitative contamination analysis...
Unique defect related to the tighter process margins on STI HDP process was investigated. The root cause was Si surface damage due to smaller top width of HDP. The defect was improved by HDP deposition process optimization derived relationship between ion incident angle and sputtering rate during deposition process. It was elucidated that HDP process is important for not only gap filling capability...
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.