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The need of isopropyl alcohol (IPA) for wafer drying has been increasing in the semiconductor industry, because the structure of semiconductor devices is getting more complicated and IPA drying is more preferable to avoid pattern disruption of complicated device structure. Also, as the feature size of the semiconductor devices continuously decreasing, the cleanliness level of IPA needs to be further...
As part of the study to investigate filter performance in the actual conditions, particle removal efficiency evaluation method of filters in isopropyl alcohol was developed. Three kinds of particles which exhibit each different charged state in the chemical, and the sizes of which are around 10 nm, were selected as test particles for the evaluation. Pall 10-nm-rated surface-modified PTFE membrane...
Since the scale of semiconductor devices are continuously reducing, the control level of size and numbers of particles are also becoming stricter during the manufacturing process; the role of filtration is of great importance for the control of particle level. Thus, it is a critical issue to use an appropriate filter in each process tool. A criterion for selecting an appropriate filter is the removal...
• Iron (Fe) contamination in cyclohexanone can be reduced using nylon 6,6 filtration, likely driven by removal of complexed Fe ions. • Reduction of metal contamination from commercial, electronics-grade cyclohexanone using nylon 6,6 filtration was confirmed, and a very high purity of cyclohexanone achieved. • Applying nylon 6,6 filtration for cyclohexanone, both in chemical manufacturing and device...
▪ “Dewetting ratio” is introduced to evaluate the degree of dewetting. ▪ High pressure at upstream side of filter is a main factor leading to “dewetting”. ▪ Vent diameter and pump driving pressure should be controlled to prevent dewetting. ▪ MST PTFE filter can resist membrane dewetting over a wider range of upstream pressure compared with native PTFE filter.
This paper describes a novel filter rating method beyond the current 30 nm limit by combining dynamic light scattering (DLS) and ICP-MS technique, and proposes the usage of gold nanoparticle as the standard challenge particle. Furthermore, the effect of protective ligand addition was investigated in order to decrease the adsorbing effect between gold nanoparticle and membrane surface.
The newest 20nm rated PTFE filter revealed better performance in both theoretical simulation of particle reduction rate in the bath and actual number of particles on wafers at a fab as compared to the conventional 30nm ratied filter. As a result, optimally designed 20nm rated filter is strongly recommended to use as recirculation filters in wet-benches for advanced semiconductor manufacturing process.
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