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This paper describes the design of an LTCC-process compatible meso-scale actuator for the six degrees of freedom dynamic adjustment of micro-optical components, in particular the alignment of a microlens array on top of a UV-LED array. The lens array is specified to have an active area of 3mm × 3mm, the GaN array is 5mm × 5mm × 450µm. The focal length is 65µm. The actuator must enable the collimation...
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. “Fan-in” (FI)-WLP typically has a limitation to be less than 6x6mm in order to pass board level reliability requirements such as drop test and temperature cycle due to the mismatch of Si material...
Electromechanical rotary joints containing multiple mechanical & electrical components are widely used to transfer power and signal (voice, data & of late video too) information from one stationary electromechanical structure /member called Stator to another rotating member of same assembly called Rotor in large platforms like Naval ships, Combat Vehicles etc. The design challenges involved...
This work describes a novel assessment model that evaluates key successful factors for implementing a green manufacturing system. The proposed model has three dimensions, i.e. green design, green manufacturing process, and green packaging. Ten strategic subjects and 68 assessment factors are established and revised based on expert opinions collected via a questionnaire. Based on the analytical network...
The trend for package size shrinkage has created challenges to thermal performance while improving the cost performance. When TO package size shrink by minimizing the leadframe copper usage, challenges in package warpage and thermal contact become great. TO High Creepage (a shrink version of new generation TO247) introduced difference copper thicknesses at die pad and heatsink for better material...
The Intel Malaysia Electronic Packaging Higher Education Program Team is proudly one of the teams to benchmark among the industry for their engagement with Malaysian universities. This team was formed with the objective of collaborating with Malaysian universities to accelerate the advancement of research and curriculum to meet rapid technology changes in the area of electronic packaging materials...
It is seen that a number of instances where the typical OA (oxide alternative) dark brown coating has turned red during lamination, typically with DICY (dicyandiamide) cured and traditional halogenated FR4 materials. Given the high moisture absorption of many DICY cured materials, there was much speculation, and empirical evidence, indicating trapped moisture is the primary reason for the color change...
Because of the viscoelasticity of the cushion material and the complexity of the products, there are usually multiple vibration modals in the packaging system. The free acceleration response of the packaging system can be expressed as the linear combination of exponentials. To identify the zeros and residues accurately, a novel approach which incoporates the modified Prony method with structured nonlinear...
The testing system based MEMS inertial devices is a kind special measurement system which is integrated with MEMS inertial sensor, ASIC and its corresponding software. Because of having merits such as small bulk, low cost, light weight, high reliability, and anti-harsh environments, it is widely used in the military and civil fields, especially suited for the high-g guided ammunition, but use what...
According to the basic principle of product life cycle analysis, this paper establishes an evaluating index system of green rationality from tripartite surfaces: the environmental factor, the resource factor and economic factor, then defines the weight coefficient for each index by AHP, and gives a fuzzy comprehensive evaluation of green rationality. Finally an example that evaluates the green rationality...
Along with the development of Internet technology, e-Learning as a flexible and convenient educational method has been widely accepted in tertiary education institutions to enhance and facilitate learning. By avoiding costly duplication and enabling the rapid creation of online courses, the employment of Learning Objects (LOs) and their reusability can benefit any educational institution when developing...
Silicon front-end and assembly and packaging technology more and more merge. In addition interconnect density reaches limits for advanced CMOS technology. In this paper we introduce the fan-out embedded wafer level packaging technology, which is an example to link front-end and packaging technology and offers additional freedom for interconnect design. We demonstrate capabilites for system integration...
Thus far, there is a severe lack of understanding about interfacial fracture and impact behavior of the microscale lead-free solder interconnects. In this study, the finite element simulation and analytical method were used to characterize the interfacial fracture and impact behavior at the interfaces of the microscale Sn-Ag-Cu solder joints. The intersection of a linear microcrack tip upon Sn-Ag-Cu...
By analyzing the effect of modulus of epoxy and modulus of filler particles on the thermal conductivity of thermal conductive adhesives (TCA), this paper concludes, in contrast to intuition, that the stiffer epoxy will generate a larger contact area, and the “soft” epoxy with modulus of 0.5GPa will create the largest contact area, hence the highest thermal conductivity. Therefore, it is advisable...
According to Solid-State Lighting Manufacturing Roadmap 2009, lower cost and higher reliability are two key necessities for LED lighting. In this paper, an optimization process of thermal design for LED lighting system is carried out from the perspective of system in packaging. Based on the three-dimensional thermo-mechanical model of LED lighting system, the thermal and mechanical performance of...
The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of TPCTP was analyzed by FTIR in this paper. Using TPCTP synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free...
To ensure high reliability for advanced automotive electronics, investigation and understanding on the failure mechanisms under harsh conditions are needed. New methods and technologies for improved reliability and increased lifetime should be developed. In this paper, an investigation on the effect of high temperature aging on the thermomechanical properties, microstructure of the molding compounds...
This paper presents design and simulation of an impedance matching network for GPS using embedded capacitor material which can substitute conventional matching network implemented by discrete lumped devices. The matching networks with ideal devices and commercial Panasonic discrete devices are simulated by ADS, and the one using embedded capacitor material is designed and simulated by 3D field solver...
In this paper, the finite element analysis method is used to investigate the thermal-mechanical behaviors of a power controller SiP module under power load. The effects of die attach (DA) material and epoxy molding compound (EMC) on the maximum temperature and maximum stress in the die are investigated. The packaging materials and geometry parameters of the module are optimized according to the simulation...
The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eight-step process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the...
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