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In this work the effect of ambient influence on the electrical conductivity of ZnO films has been studied. Nanostructured ZnO films (undoped and Ga, Co, Mn doped) were exposed to oxygen (1-80 vol.%) at temperature range 300-500degC. A dominant effect of ambient influence via oxygen absorption was observed: the intensity of conductivity decrease was found to be proportional with temperature and tends...
We report novel p-type behaviour in undoped SnO2 thin films irradiated with 75 MeV Ni+ ion beam. Gas response of the irradiated films with NH3 (reducing) and NO2 (oxidizing) gases shows an increase and decrease in resistance respectively indicating p-type conduction that also increases with increase in ion fluence. Photoluminescence spectroscopy of the irradiated films shows strong yellow peak corresponding...
Dielectric elastomer actuators (DEAs) are promising for bionic and robotic applications. Reliability requirements in such applications necessitate better knowledge of the safe operation regimes and possible failure modes of DEAs. Elastomers consist of a network of entangled and cross-linked polymer chains, able to sustain spatially varying stress and strain fields, accompanied by stored elastic energy...
Electrical contact materials deposited via thin-film processes enable the structuring of interfaces that optimize electrical contact performance. The performance gains are accomplished by structuring the contact material such that a conductive pathway is always present in the composite, a phenomenon related to the percolation threshold. The relationship between film composition and percolation threshold...
In spite of the growing maturity of silicon carbide (SiC) technology, several difficulties still remain and limit its use for high temperature applications up to 200degC. Due to its excellent physical properties, SiC material offers the ability to design electronic devices working at junction (or ambient) temperature and at power level much higher than those of the present silicon based semiconductors...
Different detection systems based on the pulsed electro acoustic (PEA) method have been developed in the last past few years to study space charge distribution in electron irradiated materials. In particular, a set-up working in contact less mode allowing the measurement to be done in open-circuit (where one surface of the irradiated sample is at a floating potential, so-called "open PEA")...
The electric invalidation of electronic connectors under fretting wear is a very complex process, and often causes automobile failures. Though the failures are troublesome, there hasnpsilat been a quantitative model to describe the fretting process. To explain the microcosmic principle, a cellular automata (CA) model based on self-organizing method is proposed. After setting up local evolution rules,...
Electrostatic charge dissipation presents a major problem for applications ranging from electronics to space exploration. A novel method to control both the bulk and the surface electrical conductivity of polymeric films is presented. By dispersing small amounts of multiwall carbon nanotubes in the polymeric material, the electrical bulk resistivity decreases by seven orders of magnitude. Also, nanolayers...
A giant magnetoresistive (GMR) head in tape recording systems is affected by the electrostatic discharge (ESD) between the sensor and magnetic shields. Pt-doped Al2O3 was developed as a dissipative gap-material to reduce the ESD current. Pt chips were sputtered on an alumina target to vary the film resistance. The decay time of a charged plate on Pt-doped Al2O3 was measured for various film thicknesses...
Fatigue strength of electroplated copper thin films was measured under uni-axial stress. Two kinds of electroplated films were prepared for the fatigue test. One was a commercial film mainly used for interconnections in printed wiring boards. The other film was grown on a stainless steel substrate by using acid copper sulfate bath without any additive agent. The micro texture of each film was observed...
Applications of a novel epoxy based dry film photoresist, PerMX3000, have been investigated in this work in case of 3D structure architecture, micro-fluid tunnel, and wafer surface molding. For different package level requirements, such material provides high resolution patterning ability for narrow pitch layout design; controllable side wall shape from positive slope to negative slope; good adhesion...
DuPont is a leading global supplier of materials used in the manufacture of a broad array of electronic components spanning from semiconductors to plasma display panels and photovoltaic modules. We are a science company with very diverse capabilities and a strong heritage of innovation in high performance materials. DuPont's newest innovations in dielectric materials and embedded passives will enable...
The electronics industry is moving from lead-based solder systems to lead-free solder systems. This change increases the processing temperatures used to melt and flow the new lead-free solders. This is causing many of the traditional polymeric materials used for electronic components to fail. Therefore, the polymers with high temperature resistance, such as VICTREXreg PEEK (poly (aryl ether ether...
For the current advanced packages, Bismaleimide Triazine (BT) substrates are widely used for making Multi-chip package (MCP) because of its high-density I/O applications. Stack-die CSP (Chip Scale Package) is developed under the concept not only for the above advantages but also for the multifunctional applications. For the purpose of mass product, the designs of stack die-attached process should...
The stratospheric balloons are the only vehicles which can stay aloft in the stratosphere (altitude range between 12 and 45 km). Pressurized stratospheric balloons have been specially developed for an onboard mass of 50 kg at an altitude near 30 km, during a flying up to 3 months. Their specifications require good mechanical strength of the adhesive system in a broad temperature range, from -90degC...
In the present study, an improved process for preparing thermally stable laminated sandwiches of non-porous fluoroethylenepropylene (FEP) and porous polytetrafluoroethylene (PTFE) films is described. Also, the thermal stability of the d33-coefficients for such fluorocarbon films is discussed.
A new class of ferroelectric polymers, i.e., the terpolymers of P(VDF-TrFE-CFE) and P(VDF-TrFE-CTFE), was developed from the normal ferroelectric PVDF polymer by employing proper defect modifications which eliminate detrimental effects associated with a normal first order F-P transition while maintaining high material responses. The introduction of the third monomer into the polymer chain serves to...
Piezoelectric ceramic-polymer composites were intensively studied within the last decades. Often piezo- and pyroelectric polymers such as polyvinylidene fluoride (PVDF) and its copolymer with trifluoroethylene (P(VDF-TrFE)) were used as matrix in order to embed ferroelectric particles such as lead zirconate titanate (PZT) or barium titanate (BaTiO3). Especially within the last decade, poly(vinylidene...
In recent years, printing has received substantial interest as a technique for realizing low cost, large area electronic systems. Printing allows the use of purely additive processing, thus lowering process complexity and material usage. Coupled with the use of low-cost substrates such as plastic, metal foils, etc., it is expected that printed electronics will enable the realization of a wide range...
The surface flashover phenomena across insulating materials always lead to the failure of system insulation and may cause serious accidents. Based on the synchronized measurement of optical and electrical signals, the flashover phenomena along alumina ceramics and polytetrafluoroethylene (PTFE) are investigated under impulse voltage in vacuum. The planar electrode system is used with the advantage...
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