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In this paper, a high-low coupled two-scale finite element method (TSFEM) for thermo-elastic problem in composite with small periodic perforated configuration is proposed. Some finite element approximate errors corresponding to TSFEM are presented.
In this paper an approach for the in-situ testing of cutting-edge thermal interface materials (TIM-s) is presented. The novel method is based on existing measurement standards and allows quick and repeatable thermal conductivity measurements on newly developed nano-composite based thermal greases in an application-like environment. During the development of the measurement system both the effect of...
Earth as a building material has already known for centuries started with plain mud and straw utilized sun dried producing brick adobe with low strength and durability until its evolved to become fired clay brick with mass rapid production in the kiln. In the growing concern of awareness regarding sustainable building material and environmental issue, Compressed Stabilized Earth Brick (CSEB) give...
As a kind of middle-temperature PCM (Phase Change Material), paraffin is perfect except for its poor thermal conductivity. Nano-aluminum, which has high thermal conductivity and good compatibility, was added into paraffin to improve its thermal conductivity. Surface modified technology was adopted and dispersant was used to prepare uniform and stable organic phase-change nano-fluid of paraffin and...
Compact tri-axial fluxgate sensor which combines new materials, traditional ring-core topology and vector field compensation is introduced. The core support material is BNP-2. This new material provides an extremely high thermal conductivity (92.6W/m.K), which helps to eliminate thermal gradients in the core. The core is made of Vitrovac 6025X amorphous metallic ribbon. Thermally stable glass filled...
Testing methods that can be used for characterization of nanostructured contact materials, which result from many of the processing routes for preparation and evaluation of nanocrystalline materials, are reviewed.
The goal of this research is to develop a consistent and repeatable method to evaluate: a) effective thermal conductivity, and b) axial and transverse coefficients of thermal expansion (CTE) of SWCNT (single walled carbon nanotube)-Cu composites, with the view to potentially replacing Cu vias with CNT-Cu TSVs (through-silicon vias) in 3D electronics packaging. Finite element models were built using...
Due to the high corrosion, high strength-to-weigh ratio and low thermal conductivity, the fiber reinforced polymer(FRP) materials are increasingly being used for the large diameter pipe, which is used to transport hot water. The temperature of the hot water is 45°C, and the ambient air temperature is 3°C in the extreme working conditions. So the strength analysis is necessary under thermal and internal...
New applications such as the use of High Brightness Light Emitting Diodes (HB-LED's) for general lighting have brought about significant demand for thin dielectric materials laminated to metal substrates such as aluminum and copper. Conventional FR-4 printed wiring laminates have limited thermal performance due to the poor thermal conductivity. To maximize thermal performance, it is necessary to minimize...
During manipulation tasks it is important to maintain a precise and safe control of the grasping force. Slip detection plays a key role to assure an adequate adaptation of the grasping force, without object damaging. Several approaches to slip detection are currently under investigation. In particular, thermal slip sensors use a detection strategy similar to the one employed in hot wire anemometry,...
We discuss the mechanical and thermal design of a high temperature pressure-mounted base-plate-less power module for application in a continuous high temperature (150°C) ambient.
In the current paper the influence of diameter of finite-length zig-zag single-walled carbon nanotube (SWNT) on its thermal conductivity at room temperature in ballistic regime was described. The fourteen types of SWNT with various chrality from (7,0) to (20,0) and with constant length (213 nm) were investigated. To calculate the thermal conductivity the non-equilibrium molecular dynamics technique...
In this work, we have analyzed the thermal properties of a GaN-based LD (laser diode) as functions of input powers, cooling conditions, and ambient temperatures. It was found that the thermal resistance has a slight change with input current under the forced cooling condition. In contrast to the forced cooling condition, significant change of thermal resistance was observed under the natural cooling...
By analyzing the effect of modulus of epoxy and modulus of filler particles on the thermal conductivity of thermal conductive adhesives (TCA), this paper concludes, in contrast to intuition, that the stiffer epoxy will generate a larger contact area, and the “soft” epoxy with modulus of 0.5GPa will create the largest contact area, hence the highest thermal conductivity. Therefore, it is advisable...
As the rapidly increasing integration density of electronics, thermal management is becoming more rigorous for the reliability of microelectronic devices. Advanced thermoelectric microcooling technology is receiving more attention due to advantages, such as long lifetime, no moving parts, and etc. In the past 50 years, researchers have been searching for materials with high ZT. Quasicrystals, such...
Nowadays, the light emitting diode (LED) is one of the most valuable light resources. However, it is well known that the optical output power is degraded with the heat integration. Hence, thermal management and evaluation system is required. Thermal conductivity is regarded as one of the most important properties that directly influence the thermal performance for thermal interface materials (TIMs)...
Packaging of electronics is an important technology to interconnect, power, cool and protect the components in highly integrated systems. Continuous size shrinking and function integration of future electronics are expected to be driven mainly by the advances in packaging technology. Carbon nanotubes (CNTs) are proposed for many novel packaging solutions thanks to their unique electrical, thermal,...
The Australian National University (ANU) is developing a new hybrid CPV-Thermal micro-concentrator (MCT) system working at a concentration ratio of 20 to 30X. System design and reliability testing have been integrated as concurrent processes, enabling the early optimisation of the concentrator system design. The key feature of this integrated design-test procedure is that carefully selected sets of...
An increased demand for high performance Thermal Interface Materials (TIMs) has been stimulated by a trend of higher power electronic designs producing significant amounts of heat. Defining the best TIM for an application requires consideration of several factors including thermal and mechanical performance, ease of assembly, reliability, and cost. The focus of this paper includes discussions of a...
In this study, we present a newly developed carbon aluminum thermal management composite material that has a CTE less than 7.5 ppm/K, thermal conductivity over 400 W/mK, and the thermal diffusivity is 2.5 - 3 times higher than that of Cu and Al. In addition, the composite material is lightweight, and can be easily machined. We also show anisotropy in thermal performance aligning along carbon matrix...
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