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Several thousands electrical connections are necessary in airplanes. Electrical cables are joined to contacts using manual crimping devices in industrial plants. When mechanical defects appear, the replacement of the defective connections has to be made directly on the airplane. This operation is difficult and time-consuming due to reduced accessibility, making it very costly. The aim of this paper...
A new type of silver rare-earth alloy contact material AgSnO2-La2O3-Bi2O3 is obtained through using a Powder Metallurgy Process. Its preparation process is cold pressing sintering re-pressure and the mixing ratio is Ag: SnO2: La2O3: Bi2O3 = 88.7:3.5:1.5. The parameters are chosen as follows: molding pressure is 10 ~ 40t, sintering temperature is 800 ~ 920°C, holding time is 2~8h, re-press pressure...
Fretting degradation has long been recognized as a major failure mechanism for electrical connector systems. In certain circumstances, such as for vehicle applications, connectors are exposed to exterior environments and could easily be infiltrated by dust and other particulate contaminants through the housing or during the mating process. The presence of particulate contaminants during vibration...
The phenomenon of magnetic blowing allows drastic reduction in arc duration. It is of specific interest in DC applications, more specifically in automotive applications. Blowing exploits the action of the magnetic force on the transitory arc formed during circuit opening. A new contact was described in a previous paper in which the magnetic field required for blowing is generated by the contact material...
Land grid array (LGA) sockets are currently used for industry standard and custom microprocessors to meet the increased performance challenges for a variety of server applications. Along with the need for increased high speed signaling capabilities comes the challenge to support lower voltages and higher currents. Typical testing that is conducted by the LGA socket suppliers does not provide an accurate...
The intermetallic (IMC) layers which form within a solder joint are necessary for a robust, high reliability bond between the joining materials. A key contributing factor affecting the strength of the joint is the roughness of each interfacial boundary and thickness of each IMC layer. Under annealing and/or temperature cycles, the IMC layer thickness and roughness evolves with time. Since the IMC...
Several studies have demonstrated that tin (Sn) whisker growth is enhanced by exposure to atmospheric and high relative humidity conditions. The presumption is that diffusion of oxygen into the Sn thin film results in the lattice expansion of metal oxide phases which place the film under compressive stress. The increased stress is subsequently relieved in part by growth of Sn whiskers. In order to...
Dust may cause corrosion in humid environment. Investigation of water solution of dust collected from Beijing and Shanghai showed that SO4-2 and Cl-1 were the major negative ions and Na+1, K+1, Ca+2 dominated the positive ions. Obvious corrosion was formed on the coupon surface when such solution was dropped on. Artificial particles including NaCl, Na2SO4 and CaSO4 are selected to simulate dust corrosion...
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