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The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads, which further affects the reliability of the interconnect. In the present work, Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200, 300, 400 and 500 μm were reflow soldered to study the size effect...
This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints'...
The compact and high-performance Lead-free BGA device has become the modern highly integrated device which is required in electronics assembly. In the course of service, they experience thermal cycling and become invalid. The failure mode of BGA device, which has undergone the thermal cycling, is investigated by scanning electronic microscope, electron back scattered diffraction and micro Vickers...
Lead-free solder alloys are more easily oxygenized and have poor wettability compared to traditional Sn-Pb solder alloys, which affects solder joints reliability. Ar is the most plentiful rare inert gas. It has been accepted that, in Ar atmosphere, the oxidation of lead-free solder joints can be prevented and the wettability of lead-free solder joints can be improved. To date, however, few systemic...
The main objective of this paper is to investigate the reliability of Sn-1.0Ag-0.5Cu low-Ag lead-free solder alloy. The wettability, mechanical property and microstructure of Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. Experimental studies have shown that the wetting property of low-Ag lead-free solder alloy SAC105 remains to be improved...
The long-term reliability of flip chip and boardlevel solder joint is significantly affected by the properties of the surface finish. Various surface finishes such as Immersion Sn, Immersion Ag, Organic solderability preservatives (OSP), Electrolytic Ni/Au (ENEG), and electroless Ni/immersion Au (ENIG) surface finish have been widely used on based Cu pads and can be compliant with lead free SAC solder...
During the soldering process, Kirkendall voids may form at the Cu/Cu3Sn interface and in Cu3Sn compound layer. Excessive formation and growth of Kirkendall voids may increase the potential for brittle interfacial fracture, and the existence of voids will reduce the thermal conductivity. Thus, characterization of formation and growth of Kirkendall voids is very important to the evaluation of performance...
Presently, Sn-Ag-Cu (SAC) solders are most commonly used as the interconnect materials in the semiconductor package. However, their thermal fatigue and drop impact resistant properties depends on the Ag content and therefore, most semiconductor package assemblers are forced to implement multiple SAC alloys depending on intended performance. Sn-xAg-Cu solders with high Ag content (x>3 mass%) give...
Thermal fatigue and room temperature isothermal mechanical performance of various Pb-free and SnPb solder joints were examined. Various solder alloys doped with Ni (SN100C) and Mn (SAC105-Mn and SACM) were evaluated and compared to SAC105, SAC 205 SAC 305 and SAC 405 and eutectic SnPb alloys. Solder spheres ranging from 10 to 20 mils were reflowed on various printed circuit board (PCB) surface finishes...
Thinner organic BGA packages typically lead to higher warpage before surface mount which, after reflow, causes package corner solder joints (SJ) to have higher stand-off compared to solder joints in the package center. Hence the solder joints at package corners can change from typical barrel shape to an elongated hour-glass shape. Conventional understanding of the impact of SJ height on temperature...
In this study, the effect of series Pb content on shear performance of SnAgCu-xSnPb/Cu solder joint was investigated. It was found that Pb content influenced the BGA solder joint shear strength significantly. The shear strength as a function of Pb content shows a parabola trend. The shear strength increased with Pb content increased from 0% to 9.22%. Then the shear strength value kept at a high level...
In recent years, the reliability under vibration loading has become a very important problem of modern electronic devices. And existing researches have shown that the results of natural frequencies and modal shapes by FEA (Finite Element Analysis) fit that of modal test well. But it is challengeable to execute the vibration fatigue life analysis rapidly and accurately. In this paper, a predict method...
3-D finite element models of SOP (Small Outline Package) were constructed, in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numeri3cal simulation was performed with three kinds of lead...
The personal electronics market is experiencing rapid growth where smaller electronics carrying more functionality is required. Increasingly, small electronic devices are expected to be incorporated into personal accessories and clothing to make them wearable. This raises great challenges to the substrate technology and related assembly technologies in electronic packaging for high density, small...
POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. The paper introduces the POP assembling procedure, aims to test and results analysis the effect of package warpage...
With the development of lead-free in electronic products, mixed soldering of lead-free component with lead solder is inevitable in high reliability electronic assembly. For the mixed assemblies, the primary task is to ensure the reliability of mixed solder joints. This study is aimed at finding out the harmonic vibration fatigue properties of plastic ball grid array (PBGA) mixed solder joints under...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge in many aspects. It has been accepted that inert N2 atmosphere can improve the wettability and reliablity of solder joints. The focus of this study is to investigate the reliability of...
The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads, which further affects the reliability of the interconnect. In the present work, Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200, 300, 400 and 500 μm were reflow soldered to study the size effect...
BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration analysis on a module by packaging module model of SAC305 lead-free BGA solder joints with ANSYS Workbench finite element analysis software was presented. The natural frequency and vibration model in 0∼2000Hz...
During the soldering process, Kirkendall voids may form at the Cu/Cu3Sn interface and in Cu3Sn compound layer. Excessive formation and growth of Kirkendall voids may increase the potential for brittle interfacial fracture, and the existence of voids will reduce the thermal conductivity. Thus, characterization of formation and growth of Kirkendall voids is very important to the evaluation of performance...
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