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The intermetallic (IMC) layers which form within a solder joint are necessary for a robust, high reliability bond between the joining materials. A key contributing factor affecting the strength of the joint is the roughness of each interfacial boundary and thickness of each IMC layer. Under annealing and/or temperature cycles, the IMC layer thickness and roughness evolves with time. Since the IMC...
Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package (PoP) with increasing demands is beneficial in cost and space saving. This study conducts the assembly of the PoP component through the stacking process. Samples are subject to thermal cycling test condition, 0°C to 100°C. The failure of samples is defined as when the measured resistance...
In this decade, the Moore's law does not fit the trend of technological improvement any more. In order to keep the increasing rate of device density and I/O numbers, the size of devices shrink rapidly. In this kind of condition, the stack of integrated circuit (IC), which is also called three-dimensional integrated circuits (3-D ICs), is a preferable solution of the next-generation products. There...
The major purpose of the mechanical stress screening is to screen out the products which have potential defects which lie in materials, design, process, and operation etc. If the screening is thorough before the products are shipped, the rate of the abnormal failure at the users' side can be eliminated or lowered significantly. The manufacturing lot which goes through appropriate screening will have...
The Ni-P alloy [or Ni(P)] with a 6-13 wt.% P content is a very common surface finishing material used in microelectronic packages. When a high P-content Ni(P) finish (≃13 wt.%) was jointed to the Sn-based solders, there are several possible P-containing intermetallics, e.g., Ni2SnP, Ni2P, Ni12P5, and Ni3P, can form at the interface. Among these intermetallics, the Ni2SnP layer played a major role...
In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
The through-silicon vias (TSVs) technology is developed recently on the microelectromechanical system (MEMS) device chip for transmitting signal and reducing the energy loss of electronic package. The reliability of this chip depends on the bonding between TSVs and solder balls. In this paper the effect of the different bonding ways between TSVs and solder balls on the thermal cycling behavior of...
Because of the relatively low reactivity with solders, Ni-based materials are the most commonly used diffusion barrier layer materials in flip chip packaging technology for Al metallization integrated circuits. However, due to the high diffusivity of Cu, the diffusion barrier materials need to be re-evaluated for Cu/low k integrated circuits. Some literatures had indicated that Co is with superior...
The implementation of the RoHS Directive in 2006 has led to a requirement that solders used in the fabrication of PCBs should be lead-free. Higher melting point lead-free solder alloys require increases in reflow temperatures, compared to eutectic tin-lead alloy solders. This has led to a substantial increase in the number of lead-free capable laminate materials over the last few years. Multi-functional...
Board level reliability is more representative of the reliability of a package operating in the field and fatigue due to loading with cyclical stresses is a major concern in solder joint reliability. In this paper, the board level reliability of two types of BGA packages CTBGA 228 and CABGA 160 under accelerated temperature cycling stress had been studied; each package contains a daisy chained die...
The copper barrel plating dissolution of printed wiring boards (PWB) occurring with multiple thermal stress testing had been studied in this paper. The thickness reduction of copper barrel plating and related copper dissolution rate were measured and compared for test specimens under the conditions of multiple thermal stress cycles (1X-6X) with two test temperatures (288°C / 260°C) in accordance with...
The fatigue life and reliability of 3D stacked die package becomes very important due to the coupling effect among all materials, especially in twin die stacked package. The article presents the quickly and more accurate optimal design for such case. Firstly, the Darveaux model is applied to predict the solder ball reliability of the stacked die package under a cyclic thermal loading condition. Then,...
The transition from through-hole technology to surface mount technology has increased the requirement for the reliability of the solder joint shear strength. The transition from lead to lead-free technology had issued new materials, but the most used alloy (SAC) offers an weaker shear strength to the solder joints than SnPb. The solder joints cannot fulfill the electrical and thermal functions if...
Condition monitoring is desired by power electronic system designers as a cost effective means of improving reliability. This paper presents a method to monitor solder fatigue inside a power module by identifying internal thermal resistance increases due to solder fatigue, taking account of the masking effects of a variable operating condition. It is assumed that the total power loss increases as...
In lead-free rework, it is almost impossible not to affect other adjacent parts when applying an existing hot-gas rework to the removal/exchange of parts as they are packed together. The fine pitch BGA components might be heat-damaged by the hot-gas or distorted, while smaller, passive components might experience a distortion of the parts due to melting of soldered joints. In such cases, it would...
Due to the increasing functional demand and miniaturization in high-density microelectronics packaging, thermomigration in flip chip solder joints owing to Joule heating becomes a serious reliability issue. In recent years, a series of researches have been devoted to examining the failure mechanism of thermomigration in eutectic SnPb and lead-free solder joints. However, only a few studies were focused...
Traditional thermal loading test neglects the influence of power applied to PoP. To address this challenge, board level reliability of PoP subjected coupled thermal and power loadings were investigated in this study. In order to provide the coupled thermal and power loadings, high temperature storage (HTS) and constant current source were chosen for the accelerated test. Five test conditions (0A,...
Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning in plastic-encapsulated IC packages is a defect frequently occurring during the solder reflow due to moisture penetration into the packages. Moisture absorption has a detrimental effect on the EMC/Cu interfacial adhesion and drastically reduces the reliability of the encapsulated package. To obtain good...
Wafer level Chip Scale Package (WLCSP) fulfills the demand for small, light, and portable handheld electronic devices, and it is one of the most advanced packaging concepts. When the WLCSP was assembled on board level, the connection, i.e. solder joints are generally the critical and challenging issue for the whole device's reliability. In addition to the shape and material of solder joints, the material...
High power semiconductor lasers have found increased applications. Indium solder is one of the most widely used solders in high power laser die bonding, its' reliability is rated as the key parameter deciding about the more or less extensive use of indiun solder die bonding of high power diode arrays. In this paper, 20 samples were tested under two conditions, three degradation modes were observed...
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