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Heat generation in the active region leads to high junction temperature that significantly affects electrical and optical properties, reliability and lifetime of high power diode laser arrays. It is of great importance to understand the thermal behavior to improve the devices. Compared to conduction cooling techniques, diode laser arrays packaged on microchannel heat sinks have superior capability...
The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The...
For the last few decades semiconductor industry has been following Moore Law effectively, which has resulted in significant miniaturization of transistors and chip logic circuitry, and the development of 3D integration technology. While due to the large size and extremely thin of chip and interposer, increasingly attention has been payed to the warpage, which was regarded not only decide the assembly...
In this study, a 3D copper pillar bumps model was established to investigate the reliability of the interconnection under thermal-electric coupling. In order to ensure the accuracy of the model, infrared thermography was used to verify the simulation of temperature distribution. The test not only proved the feasibility of this model, but it also indicated impact of Joule heat effect on temperature...
Through Silicon Via(TSVs) technology is one of the most prominent feature in future microelectronic devices packaging. Since TSVs contain the interfaces of heterogeneous materials that have high CTE mismatch, and would hence produce large thermal stresses under temperature loading, often leading to mechanical failure. A failure stress mathematical model is established and the algorithm of mathematical...
In order to reduce the cost of solder materials and retard the thermal shock of temperature-sensitive electronic components during packaging process, SnBi solder paste was explored to replace SnAgCu solder paste due to the low melting temperature. In this study, BGA structure Cu/solder-ball/solder-paste/Cu joints were designed and prepared to study the interfacial reactions and microstructural evolution...
In this study, Sn/Cu soldering interface and the growth characteristics of IMC grains were in-situ investigated. High-pressure air (0.8MPa) was used to blow away the residual liquid solder on the Cu substrate at different soldering temperatures (250 ° C, 275 ° C, 300 ° C) and different soldering time (10s,30s,60s,120s), thereby obtaining the unobstructed view for growth morphology of IMC in the heating...
The wide band-gap semiconductor devices, such as SiC, GaAs power devices, provide great opportunities to develop power electronic systems with increased power densities, high reliability in extreme environments and higher integration density. High-temperature resistance is needed for the thermal interface materials. In this work, the intermetallic joints consisted of nearly sole Ni3Sn4 during die...
In this paper, a novel new package solution for CMOS image sensor (CIS) based on molding compound interconnect substrate (MIS) is proposed. First, a 13 million pixel CIS packaged by quad flat no lead (QFN) is chosen as a reference. Considering the design parameters, a new package structure based on MIS is designed. Second, Two kinds of three-dimensional finite element models of CIS package are respectively...
Size effect of solder balls on the interfacial reaction and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints during isothermal aging at 125 °C was systematically investigated. Results show that a large amount of bulk Cu6Sn5 phase distributes in the solder matrix of joints with large solder ball size, resulting from larger outflux Cu atoms from the interface...
As the demand expanding for high electrical performance, high pin count and low cost, the copper pillar bump packaging has been extensively used in recent years. However, the drawback is that copper pillar bump can introduce high stress, especially on low-k chip. In this paper, finite element method was adopted to optimize the structure of copper pillar bump, aiming at relieving the stress of low-k...
The flip chip package is an advanced chip interconnection technology, which has become a main technology of high density package. This paper mainly studies the influence of bumps deformation in the flip chip bonding process on connection reliability, which provides theoretical reference for the flip bonding process. Bumps deformation is a key factor for the chip reliable connection in the flip chip...
Preparation of BGA micro-joint with single-double substrates used by SAC305 lead-free solder is fabricated by reflowing process based on substrate FR-4. The microstructure change and evolution law of the solder joints are studied through the method of rapid thermal fatigue. The single-base plate SAC305/Cu solder joint was tested at extreme temperature 60–200°C by rapid thermal cycle 24 hours and 36...
As the trend develops towards miniaturization to meet the requirement of performance improvement in portable consumer electronics, Joule heating has become a key reliability issue in the future electric packages, especially in the 3D integrated chip, in which the micro-bump is approaching 10µm. Heat flux must be dissipated away by temperature gradient which could reach 1000K/cm under which condition...
This paper investigates the reliability of the Package-on-Package (PoP) under random vibration loading by experimental tests and FEM simulations. An event detector was used to monitor the PoP failure times under random vibration. A finite element model of the PoP assembly model was built in ANSYS, and the natural frequencies and modes were calculated and verified by experimental model test. The results...
Physically Unclonable Functions (PUFs) were introduced over a decade ago for a variety of security applications. Silicon PUFs exploit uncontrollable random variations from manufacturing to generate unique and random signatures/responses. Existing research on PUFs has focused on either PUF design at the architectural level or optimization of lithography to increase sensitivity to random process variations...
A newly IGBT module combined with liquid epoxy resin encapsulation and insulating metal baseplate (IMB) has been developed. IMB is insulating sheet with thick baseplate, and has large mounting area compared to ceramic substrate. The properties of liquid epoxy resin such as glass transition temperature, coefficient of thermal expansion, long-term thermostability are optimized for employed metal baseplate...
In this paper, we study the reliable virtual network mapping (RVNM) problem for allocating virtual machines (VMs) from multiple data centers (DCs) with the objective of maximizing the total reliability of a virtual network under two capacity constraints: computing capacity constraint at each DC and bandwidth capacity constraint on each link. We first describe graph models of RVNM, formulate the RVNM...
This paper reports on the development of packaging technology for the assembly of 30µm pitch micro Cu pillar bump (15µm diameter) on organic FCCSP substrate having bare Cu bondpad without NiAu or OSP surface protection. The assembly was performed by thermal compression bonding (TCB) with non-conductive paste (NCP). Finite element modeling and simulation were carried out to understand the Cu pillar...
Gallium liquid metal joints are described as an alternative to higher melting point tin-or lead-based solder joints in flip chip packages. A complete assembly process is described, including the bumping process with the electrodeposition of gallium on corrosion resistant bonding pad, a low-temperature and low bonding force chip joining process with a HCl flux, and an underfill process with a low stiffness...
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