Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
An approach to simultaneously reduce the length of bond wires and trace parasitics within substrate-based, chip-on-board (COB), ball grid array (BGA) packages is presented. Three, two-layer, 8mm × 14mm COB BGA packages were modeled and analyzed using Ansoft Turbo Package Analyzer's (TPA) 3D boundary element method (BEM). The initial package design has long interconnecting bond wires from the die to...
Magneto-transport prosperities of the Gd film and wire have been investigated. Negative magnetoresistances due to the reduction of the spin entropy were observed at various temperatures. The magnetoresistance changes were found to depend on the direction of the in-plane magnetic field at low temperature because of the Lorenz magnetoresistance effect. The strong spin current absorption effect into...
This paper presents a novel method to detect the volt-ampere characteristic of vacuum arc. Highlights of this paper can be concluded that: the basic structure, computation models, designing principles and procedure, and selection criterions of materiel and electromagnetic parameters of the coil are analyzed respectively. The main clue of this paper is the operating principles of the Rogowski Coil...
Step and touch voltage are two main parameters of a grounding system. Common way to reduce these two factors is using distributed mesh network under ground of substation, but wind turbines grounding system are different and limited area. In this paper, the wind turbine grounding system will be analyzed and step and touch voltage will be obtained. For this purpose, CYM software is used analyze a real...
A new equalized on-chip global link structure is proposed for ultra-high-speed and low-energy communication by utilizing continuous-time linear equalizer (CTLE). Modeling and optimization approaches for each building block are introduced and a low-power driver-receiver co-design methodology is proposed to greatly reduce energy-per-bit by 50%. Final design can achieve 20Gbps signaling over 10mm, 2...
This paper investigates and realizes the self-sensing capability of shape memory alloy (SMA) actuators. SMA exhibits large stroke, high energy density, and requires low driving voltage. To make SMA more applicable to small scale robotic manipulations, its motion control using accurate self-sensing is necessary. The presented technique builds a self-sensing model by measuring the SMA electrical resistance...
Nowadays, both industrial and residential consumers use power electronics with the aim of rational use of energy or the implementation of distributed generation. However, power electronics may cause harmonic currents. Since cable losses are function of the rms current, harmonic currents will increase cable losses. This contribution analyses the influence of the current harmonic spectrum on low voltage...
With the every decreasing pitch spacing of required in the microelectronic packaging industry, higher bond quality is required. In order to further understand the mechanics of the bonding operations, the vibration of the transducer is being studied to identify how bonding quality can be improved. In this paper a computational efficient method of analysing the vibration of the transducer is described,...
Selecting an appropriate conductor joint method is essential by considered conducting wire safety performance. The Analytical Hierarchy Process (AHP) method is usually used for solving multi-criteria decision-making problems. However, the traditional AHP method is incapable of handling the uncertainty and vagueness involving the mapping of one's preference to an exact number or ratio. In this paper,...
Thin film production by exploding wires is affected by many factors; one of such factors is the energy deposition rate. The research in this study focused on measuring the voltage and current of an exploding copper wire that was 15 cm long and 0.3 mm in diameter. The time-dependent wire resistance and the energy deposited into the wire were deduced from the measured voltage and current, and the maximum...
The dipole is the fundamental elemental antenna. Moreover, the electric dipole and its monopole equivalent on a groundplane are widely used in practice. Despite the long history of dipole research, its complete impedance behaviour remains elusive. In numerical techniques, such as the method of moments, a gap voltage feed can be expected to give a well-defined radiation conductance but a susceptance...
To remove the bottleneck of the interconnect especially at semi-global and global level, performance evaluation of local, semi global, and global interconnect is presented in this paper based on carbon nanotube (CNT) interconnect bundle model. For the greater length of the wire, a methodology is presented to find the optimum insertion and size of buffer for CNT bundle interconnects. The performance...
For faster timing closure, a parasitic extraction method is developed for the pre-route VLSI design. This method generates virtual route and estimates congestion using the placement information of standard cells, and then extract the interconnect parasitics with the pattern-library method. The techniques of generating parasitic RC tree according to the improved FLUTE algorithm, and capacitance extraction...
Antenna efficiency directly impacts the efficiency of communications and sensing applications, and the emerging use of high frequencies has renewed interest in its mechanisms and estimation. In this paper, the radiation efficiency of the half-wavelength center-fed circular dipole is calculated for representative metals. Both the approximate and the accurate current distribution models for the wire...
The performance of very large scale integration (VLSI) circuits is depends on the interconnected routing in the circuits. In VLSI routing, wire sizing, buffer sizing, and buffer insertion are techniques to improve power dissipation, area usage, noise, crosstalk, and time delay. Without considering buffer insertion, the shortest path in routing is assumed having the minimum delay and better performance...
Solid-electrolyte crossbar switch (namely NanoBridge) with low programming current of 420μA and highly reliable ON state against pulsed-alternating current (AC) stress is demonstrated under practical operating conditions of a programmable logic device (PLD). The ON-state duration under a pulsed-AC stress is achieved >10 years at 150°C. The high reliability under AC originates from the fact that...
Nanomaterials have been studied in both the primary and secondary liquid coatings for electrical insulation applications such as motors and transformers. It has been found that improvements in moisture resistance, abrasion resistance, pulse endurance survivability and flexibility are possible versus current state of the art systems that use micron-size inorganic materials. It has also been found that...
Reason was analyzed that cable monitor wire protection was easy to make incorrect operation and failure action led by the stray interference signals. Full-wave Fourier Algorithm was deduced which was realized by filtering decaying dc component using table lookup. And on this basis, protection principle of time-sharing amplitude ac cable monitor wire with terminal resistance was proposed and proved...
Wire array or nanowire based silicon solar cells based upon radial p-n junctions have been investigated over the past few years for enhanced light trapping, as well as for being able to offer radial junctions that are in close proximity to photogenerated carriers. To date, however, silicon wire array cells have not been able to demonstrate efficiencies higher than their planar controls. We have studied...
The electrical performance (such as electrical resistance, inductance and fusing current capability) is a key factor for a power electronic product. Studying the impact of the defect on package electrical performance, especially for the parasitic effect is very important. It can help to understand the potential root causes and failure mechanisms, as well as to ensure the electrical performance meets...
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.