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Ieee transactions on components and packaging technologies > 2010 > 33 > 3 > 621 - 628
IEEE Transactions on Electron Devices > 2010 > 57 > 11 > 2821 - 2830
IEEE Electron Device Letters > 2010 > 31 > 10 > 1155 - 1157
IEEE Electron Device Letters > 2010 > 31 > 12 > 1452 - 1454
IEEE Electron Device Letters > 2010 > 31 > 7 > 722 - 724
IEEE Transactions on Advanced Packaging > 2010 > 33 > 1 > 58 - 63
IEEE Electron Device Letters > 2010 > 31 > 4 > 347 - 349
IEEE Transactions on Electronics Packaging Manufacturing > 2010 > 33 > 2 > 135 - 142
IEEE Transactions on Device and Materials Reliability > 2010 > 10 > 3 > 307 - 316
IEEE Transactions on Industry Applications > 2010 > 46 > 5 > 2046 - 2055
IEEE Transactions on Advanced Packaging > 2009 > 32 > 3 > 683 - 694
IEEE Communications Letters > 2009 > 13 > 7 > 492 - 494
IEEE Transactions on Electron Devices > 2009 > 56 > 8 > 1579 - 1587
IEEE Transactions on Device and Materials Reliability > 2009 > 9 > 4 > 563 - 568
IEEE Circuits and Systems Magazine > 2009 > 9 > 3 > 20 - 31
Ieee transactions on components and packaging technologies > 2009 > 32 > 3 > 684 - 692
IEEE Transactions on Electron Devices > 2009 > 56 > 1 > 2 - 12
IEEE Transactions on Nanotechnology > 2009 > 8 > 4 > 542 - 559
IEEE Transactions on Device and Materials Reliability > 2009 > 9 > 1 > 9 - 19
IEEE Transactions on Device and Materials Reliability > 2009 > 9 > 2 > 120 - 127