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IEEE Electron Device Letters > 2011 > 32 > 4 > 560 - 562
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 2 > 278 - 289
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 5 > 798 - 808
IEEE Electron Device Letters > 2011 > 32 > 2 > 200 - 202
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 1 > 201 - 203
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 1 > 98 - 105
IEEE Electron Device Letters > 2011 > 32 > 6 > 806 - 808
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 5 > 660 - 672
IEEE Journal of Solid-State Circuits > 2011 > 46 > 1 > 293 - 307
IEEE Transactions on Electron Devices > 2011 > 58 > 10 > 3369 - 3378
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 4 > 540 - 547
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 10 > 1601 - 1607
IEEE Transactions on Electron Devices > 2011 > 58 > 12 > 4354 - 4360
IEEE Electron Device Letters > 2011 > 32 > 12 > 1731 - 1733
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 12 > 2005 - 2017
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 12 > 1908 - 1915
Journal of Electronic Materials > 2011 > 40 > 10 > 2119-2125
Microelectronic Engineering > 2010 > 87 > 3 > 348-354