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For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch <; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
Wire bonding has been the dominant mode of chip to substrate interconnection for many decades. The most common metal used has been gold which is rather malleable and very resistant to oxidation and corrosion. The surge in commodity prices over the last few years has prompted the introduction of copper as a lower cost alternative. While copper has some advantages electrically, thermally and mechanically,...
The efficiency of electrokinetic remediation of Cu contaminated groundwater was researched by means of experiments for the complicated remediation of groundwater contaminated by typical heavy metal in this paper, and migration and variation characteristics of Cu was analyzed too. The experimental results indicated that the pH value varied obviously during the electrokinetic remediation because of...
Smaller diameter Cu wire has been incorporated in actual volume production and migrated into fine pitch IC packages in the past few years. Copper is easily oxidized by forming copper oxide that will hinder the welding process between copper to Aluminum bond pad surface. Forming gas must be used to protect the copper from reacting with oxygen for this reason. Intensive studies that focused on EFO parameter,...
An innovative electrochemical sensor based on a combination of the elimination voltammetry and adsorptive stripping (AdS) techniques with a slightly soluble complex is presented. The test of our approach was aimed at analysis of aminopurines and oxopurines on carbon paste (CPE) and pencil graphite electrodes (PeGE). The voltammetric signals of purine derivatives are amplified: (i) by increasing the...
Due to concerns over the environmental impact of mineral oil, alternatives such as dodecylbenzene and vegetable oils have been proposed for high voltage applications. The ageing behavior of various vegetable oils has been previously investigated and it was found that oils offering the best ageing resistance were also the most expensive. The current work examines the ageing behavior of blends of sunflower...
The broad time-to-failure distribution and bimodality of downstream electromigration (EM) in 45nm technology node are investigated. Liner void and end of line void at wafer edge on downstream EM structure after M1 CMP is a clear physical vapor deposition (PVD) shadowing effect signature caused by poor liner gap fill capability. Furthermore, void growth study during early electromigration stage effectively...
The equation of resistance drift governing oxidation is derived in this paper for Copper-Top (Cu-Top) interconnects to assess reliability of Cu-Top. Our equation is not only demonstrated by thermal storage tests at various temperatures but also characterized by dependence of time, temperature, metal width, and additional dielectric & conductive layers over Cu-Top. As a result, this approach enables...
The worldwide transition to lead-free electronics has increased the usage of several lead-free pad finishes for electronic packaging industry, including ENIG (Electroless nickel immersion gold), ENEPIG (electroless nickel electroless palladium immersion gold), immersion Sn, immersion Ag, and OSP (Organic solderability preservatives). The ENIG process generally involves cleaning the bare Cu, etching,...
Currently, consumer electronics, flexible and portable electronic products are the most popular because of further miniaturization accompanying more functionality per device and low costs. To produce high volume, high-density interconnect substrates, flexible printed circuits (FPCs) will become more and more important. For the fabrication of FPCs, polyimides (Pis) possess many outstanding properties,...
Tin plating of lead frame packages has been driven into the market to meet Green requirements. To avoid tin whiskers issue, Sn-Cu and Sn-Bi are the other option in stead of pure Tin plating. Copper oxidation will give rise solder blisters if machine breakdown during Sn-Cu plating process for lead frame packages. The poor contacts resulted in contact area due to copper oxidization which in turn caused...
The last three years have seen an aggressive implementation of fine-pitch copper wire bonding in face of ever-increasing gold prices. Numerous technical hurdles associated with copper wire bonding have mostly been overcome. However, achieving process robustness equivalent to gold wire bonding is still challenging and requires enhanced manufacturing control procedures. Although the 2nd bond in copper...
Because of its high thermal conductivity, great electrical property and low cost, copper wire is considered to replace the conventional gold wire and is becoming widely used in IC assembly processes recent years. Compared to gold wire, copper wires has higher thermal conductivity, lower electrical resistivity, and higher pull strength allowing for a reduced wire diameter. Besides, copper wire is much...
Copper wire bonding is the most effective alternative of gold wire bonding. As copper is more chemical reactive than gold, easier oxidation is one of the most major problem copper wire bonding encountered. Anti-oxidation technology must be used in copper wire bonding process. In general, there are two different ways to improve the anti-oxidation properties of copper bonding wire. One of which is injecting...
The microstructual stability of Sn-8Zn-3Bi/Cu and Sn-8Zn-3Bi-0.3Cr/Cu joints has been investigated under 85 °C temperature and 85% humidity conditions as a function of exposure time. The evolution of interface and near surface cross-sectional microstructures during exposure has been examined. A continuous single layer of intermetallic compound (IMC, hereafter) appears in both of the two kinds of solders...
Copper electrodeposited on nickel and copper alloys substrates is easy to be oxidized, and the adhesion between the oxides and substrates can be so poor that delamination happens at these interfaces, which may lead to an overall failure to the electronic device. In this work, three different substrates were prepared by applying direct current; of all these substrates the amorphous nickel-phosphorous...
The influences of CeO2 and La2O3 on catalytic wet air oxidation of PH3 was investigated. CuO catalysts, CuO-CeO2 catalysts and CuO-La2O3 catalysts were prepared using the co-precipitation method. Results revealed that the purification efficiency of PH3 removed by the combination of Ce and Cu oxide was good. The catalystic activity of CuO-CeO2 catalysts influenced by the ratio of Cu to Ce was studied,...
Four different transition catalysts (V, Cr, Zn, Mo) supported on TiO2 were prepared by incipient impregnation and their performances of selective catalytic oxidation (SCO) of ammonia(NH3) were investigated in mixed gas in which 500ppm ammonia was included and the gas hourly space velocity(GHSV) was 35385h-1. The results shown that 99% ammonia removal efficiency, 19% nitric oxide (NO) conversion and...
The oxidation free copper nanoparticles were synthesized by electron beam irradiation in the ethylene glycol matrix without reduction agent. This electron beam irradiation reduction method (EBIRM) was simple and clean process because of unused the reduction agent. The metal precursor solution was prepared as fellow. The CuSO4·5H2O and polyvinylpyrrolydone (PVP) were soluted in the ethylene glycol...
A thermodynamic mechanism has been developed to explain the formation of aligned cupric oxide (CuO) nanowires synthesized by thermal oxidation of copper substrates at different conditions. The 1D morphology and temperature dependence of parameters of nanowires were explained.
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